Substrate Material and Process Development Engineer

Intel • Chandler, AZ

4d • Hybrid

About The Position

Are you passionate about pioneering the future of advanced packaging technologies and driving innovation in materials science? Join Intel's cutting-edge team as a Substrate Material and Process Development Engineer, where you'll play a pivotal role in developing revolutionary substrate material, processes that enable Intel's roadmap for next-generation packaging platform technologies. This is your opportunity to work at the forefront of semiconductor innovation, applying novel concepts and innovative solutions that will shape the future of computing. As a Substrate Material and Process Development Engineer, you will be instrumental in developing Substrate material, process while applying groundbreaking concepts for innovative solutions. You'll optimize manufacturing efficiency, develop processes that meet stringent quality and reliability requirements, and lead efforts in problem-solving and continuous improvement using experimental design and statistical methods. Your expertise will directly contribute to Intel's mission of delivering world-class packaging technologies. Why Join Us? This is your chance to be part of a team that's revolutionizing semiconductor packaging technologies and making a global impact. You'll work with cutting-edge materials and processes while collaborating with world-class engineers to solve tomorrow's challenges today. Ready to shape the future of advanced packaging? Apply now and join our mission to drive innovation in materials science and process development!

Requirements

• Bachelor's with 6 years of experience or Master's degree in 4 years of experience or PhD with 2+ years of relevant experience in Polymer Science and Engineering, polymer physics, Materials Science, Chemical Engineering, or related science and engineering fields.
• 2+ years of experience in polymer synthesis or advanced packaging and assembly processes

Nice To Haves

• 4+ years of experience in polymer synthesis, materials development, and materials science fundamentals
• 4+ years of advanced packaging and assembly process experience
• Materials characterization skills (SEM, FTIR, TMA, DMA, DSC, TGA, SIMS, mechanical testing)
• Experience in tool and process PCS, data analysis, statistical tools and methods

Responsibilities

• Define substrate materials roadmap to enable leading edge packaging technologies.
• Develop material and process specifications applying principles of design of experiments and data analysis and document improvements through white papers.
• Work with material vendor for new material development to meet Intel process capability and performance target.
• Innovate new process concepts and validate process flow for HVM applications.
• Qualify new materials and processes with comprehensive characterization plans
• Optimize and improve the efficiency of manufacturing of packages, developing material/processes to meet quality, reliability, cost, yield, productivity and manufacturability requirements
• Drive continuous improvement projects and problem-solving efforts
• Collaborate with cross-functional teams throughout all project phases
• Provide excellent communication Skills to navigate uncertainties
• Ability to work in a matrixed environment with smooth stakeholder interactions
• Responsible and commitment with a can-do attitude
• Travel and flexibility to meet business needs

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel .

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees