Student (2)

Purdue University • West Lafayette, IN

328d

About The Position

The Purdue Applied Research Institute (PARI) and Purdue University are experiencing rapid growth in multiple areas of microelectronics research. Through our partnerships with Navel Surface Warfare Center Crane Division (NSWC Crane), DARPA, imec, and other government and industry partners, we plan to be at the center of microelectronics research for the heartland. PARI is thus seeking summer research interns in STEM fields relevant to microelectronics to support these efforts. PARI is soliciting candidates from freshman to senior level to support research endeavors based in Crane, IN. Through a partnership between PARI and NSWC Crane, students will have the opportunity to work on projects focused on microelectronics for DoD applications. Interns will work collaboratively with NSWC Crane labs and PARI staff located at the adjacent Westgate facility. Some projects may also include collaboration with regional microelectronics industrial base facilities at Westgate.

Requirements

• Enrolled in undergraduate program in Electrical Engineering, Mechanical Engineering, Physics, Materials Science, or related STEM fields relevant to microelectronics.
• Candidates must have completed at least one year of their program.
• Must be able to obtain a Secret or Top Secret security clearance.
• US Citizenship is required.

Nice To Haves

• Background in heterogeneous integration and advanced packaging.
• Experience in systems engineering and Model-Based Systems Engineering.
• Experience in semiconductor fabrication processes, including lithography, deposition, etching, and material characterization.
• Background in microelectronics device and circuit design, including familiarity with CAD tools and simulation software.
• Experience in testing and characterizing microelectronic devices using state-of-the-art equipment and measurement techniques.
• Excellent problem-solving skills and the ability to work collaboratively in cross-functional teams.
• Strong communication skills, both written and verbal.

Responsibilities

• Contribute to the design, fabrication, characterization, and packaging of novel microelectronic devices and circuits.
• Collaborate with cross-functional teams to drive innovation and solve complex technical challenges.
• Support research in multiple areas of advancing the state of the art in microelectronics.

Benefits

• Paid internship position.

What This Job Offers

• Career Level: Intern
• Industry: Educational Services
• Education Level: Bachelor's degree