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The Advanced Packaging Flow Development Intern position at Siemens Industry Software is part of the Strategic Student Program, designed for university students to gain practical experience in the Electronic Design Automation (EDA) industry. The intern will work with the IC Packaging Applications Engineering team, focusing on developing automation flows and scripts to enhance design workflows for advanced packaging solutions. This role offers a unique opportunity to apply academic knowledge to real-world challenges while collaborating with experienced professionals in a dynamic learning environment.