Staff Signal Integrity Engineer

Micron•Boise, ID

17d

About The Position

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Signal Integrity High Performance Memory Systems Group drives the high end, high performance, high speed product signaling and power designs for products like HBM, GDDR, LPDRAM, DDR5/DDR6, PCIeGen6 and sophisticated signaling development. We handle the interconnect and signaling exploration and development to proactively engage in future performance scaling through sophisticated signaling techniques and package / channel improvement, including circuit power reduction, data encoding, channel equalization, and new interconnect technologies. Traditional interface standardization efforts through JEDEC and similar standards bodies and through close customer / partner engagements. Modeling and methodology improvement within the larger Signal Integrity group and throughout Micron where applicable. We are encouraged to engage across multiple subject areas and organizations (e.g., Signal Integrity, Circuit and Chip Design, Packaging R&D and System Integration)!

Requirements

PhD or MSEE w/10 years of industry experience.
Strong SI/PI/EMI theory and application, modeling, analysis, simulation.
Signal and Power Integrity Background, particularly in areas that affect I/O circuit and signaling performance.
Required courses covering electromagnetic, transmission line and RF theory, analog design or similar fields of study or experience.
Experience with, and intermediate working knowledge of, E.M. field solvers (quasi-static and full wave), time and frequency domain simulation tools like Q3D, SIWAVE, HFSS, HSPICE, ADS, etc.
Deep understanding of electromagnetic and transmission line theory, general I/O design, signal integrity, differential and single-ended interface technologies.
Deep understanding of timing budgets and jitter analysis.
Expertise in Printed Circuit Board (PCB) layout or electrical package design techniques.
Experienced in design and analysis of high-speed single-ended or differential buses.
Familiarity with, and fundamental understanding of, lab measurement equipment like Oscilloscopes, TDR, Vector Network Analyzer (VNA), etc.
Familiarity with statistical analysis (DOE) and equivalent tools (example: JMP) is also beneficial.

Nice To Haves

Master's degree or PhD in Electrical Engineering or related technical field
Mixed-signal Circuit Design Background.
Memory industry experience.

Responsibilities

Development of future improvement in performance scaling, signaling, and sophisticated packaging
Leverage modeling and simulation methodology to improve accuracy to signal integrity within or exceeding spec
Active mentoring of junior team members through informal one-on-one collaboration and through more formal department-level and corporate-level opportunities
Groundbreaking – think “outside-the-box” and yet offer innovative solutions within a set of practical constraints.
Actively communicate and clearly convey vital details of sophisticated issues and corresponding solutions in both written and verbal formats

Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
Additionally, Micron benefits include a robust paid time-off program and paid holidays.
For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits .

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