We are looking for a senior Electrical Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve design and development of single or multi-chip modules that would integrate GaN, GaAs or Silicon based MMICs in various type of advanced state-of-the-art packaging technologies. Additionally, depending on experience level, a portion of your time could be involved in mentoring other team members in contributing new and innovative design ideas. You will be a key member of an integrated product development team that includes marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees