Staff RDA/Metrology Engineer, APTD

Micron Technology

123d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. As a Staff Metrology Engineer, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. Additional responsibilities include coordinating and carrying out process, equipment and material evaluation/optimization to implement changes at process step, leading and participating in yield improvement and cost reduction activities, handling new process baseline qualifications and managing, auditing and liaising with material suppliers to achieve quality, cost and risk management objectives.

Requirements

• Ability to manage projects to ensure deliverables are completed on time and on budget
• Experience with design of experiment techniques (DOE), Statistical Process Control (SPC), Defect analysis and data analysis
• Ability to resolve complex issues through root-cause or model-based problem solving
• Bachelors of Science + 6yrs experience or Masters of Science + 3yr experience or PhD in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Chemistry, Physics, or other related technical fields or proven experience
• Experience in semiconductor process engineering and packaging with fundamental understanding of incoming and outgoing process and equipment interactions

Responsibilities

• Identify, diagnose and resolve assembly process related problems
• Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step
• Lead / participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Support SPC/FDC/RMS/APC
• Support site to site portability
• Manage / audit material suppliers to achieve quality, cost and risk management objectives
• Support internal and external audits

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Bachelor's degree
• Number of Employees: 5,001-10,000 employees