About the position
Looking for your next career challenge? We seek an experienced Electronics Engineer specializing in PCB Silicon packaging co-design to join Arm's Packaging, Boards and Multiphysics team. You will be involved with systems that incorporate Arm processors, focusing on aspects like chip packaging and System-on-Chip (SoC) integration. We develop physical hardware platforms used for software development and validation activities for both external partners/customers and our internal development teams. The team is working at the forefront of embedded compute focusing on prototyping Arm's latest IP products.
Responsibilities
- Collaborate with engineering teams across multiple geographies to specify, evaluate, analyze and develop solutions for optimal PCB and silicon package integration.
- Drive the PCB development alongside the chip packaging team, including brainstorming breakout and routing strategies, design rules and layer optimization to ensure optimal performance, reliability, and cost-effectiveness.
- Provide timescale estimates and justifications into the program team.
Requirements
- Strong understanding of electronics and embedded compute systems.
- Familiarity with different IC packaging technologies and their impact on PCB design to ensure seamless integration of SoCs, ensuring proper signal routing and power delivery.
- Experience of collaborating with chip packaging teams.
- Ability to influence and drive SoC device pin-outs for cost optimization, routing feasibility and layer trade-off analysis.
- Detailed knowledge of high-speed design and interface standards (e.g. PCIe and DDR memory technologies).
- Expertise in escape routing analysis of high density SoCs and able to provide estimates of the IO count that can be routed with a particular stack-up and design rule set.
- Extensive knowledge of Signal and Power Integrity analysis techniques from both board design and chip packaging perspectives.
- Understanding of the PCB fabrication process (PTH and HDI), stackup/VIA topologies and substrate materials.
- Ability to collaborate with PCB fabricators and CEMs.
- Proficiency in the use of EDA tools, specifically Cadence Allegro PCB suite and OrCAD CIS.
- Good communication and interpersonal skills.
- Positive can-do attitude and attention to detail.
Nice-to-haves
- Experience in using Signal Integrity tools from ANSYS, Siemens EDA etc.
- Experience of design automation and scripting.
- Enjoy collaborating and working in across geographies with multiple teams.
Benefits
- Gain a deeper understanding of high-performance compute platforms.
- Work alongside other engineering teams in a friendly supportive environment.
- Collaborate with highly motivated, like-minded engineers.
- Produce high quality designs incorporating Arm IP.
- Enjoy new technical challenges faced when using advancing technologies.
