Staff Memory Sustaining Physical Design Engineer, HBM

Micron Technology•Boise, ID

9d•$135,000 - $286,000

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions. The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability. HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Physical Design Engineer in sustaining role you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration (PI), Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will be responsible for supporting design and development of critical analog, mixed-signal, digital block and full chip level integration from physical design and layout design perspective! This includes creating floorplans that optimize circuit placement, signal routing, and power delivery, as well as deliver block-level layouts using advanced foundry process node. You will work with a highly innovative and motivated design team using groundbreaking memory technologies to develop the most advanced HBM products!

Requirements

Bachelor’s or Master’s degree in Electrical Engineering or related field.
8+ years (BS) or 6+ years (MS) of relevant experience.
Expertise in Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
Strong grasp of analog layout fundamentals including matching, electro-migration, latch-up, coupling, crosstalk, IR-drop, and parasitics.
Hands-on experience crafting analog and mixed-signal layouts (e.g., sense amplifiers, LDOs, PLLs).

Nice To Haves

Strong verbal and written communication skills for conveying complex technical concepts.
Self-motivated great teammate who thrives in diverse environments.
Proven innovation and problem-solving in high-performance memory development, with experience in DRAM bring-up/debug and advanced packaging (TSV, hybrid bonding, interposers).

Responsibilities

Implement layout changes to resolve issues identified on current HBM designs on silicon and drive towards a timely and efficient tapeout.
Interact with teams like DE, PE, PI and TD to understand the challenges due to process limitations and propose layout solutions to alleviate the issues.
Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption.
Responsible for floor plans that optimize circuit placement, signal routing, and power delivery.
Deliver block-level (analog or mixed signal) layouts using advanced foundry process node if needed.
Contribute to the development of new HBM product opportunities by assisting with the overall planning and optimization of Memory, Logic, and Analog circuits layout.
Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products.
Mentor new hires as needed.

Benefits

Additional compensation may include benefits, bonuses and equity.
Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
Additionally, Micron benefits include a robust paid time-off program and paid holidays.

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