Micron Technology-posted 2 months ago
Full-time • Mid Level
Richardson, TX
5,001-10,000 employees
Computer and Electronic Product Manufacturing

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Design Engineer in sustaining role you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will interact with the architecture team to understand new or modified specification requests, and you will work with the team on implementing and verifying the design, supporting the design release to silicon and all future needs arising for the design. You will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM products.

  • Contribute to the design, layout, and optimization of Memory, Logic, and Analog circuits for HBM products.
  • Parasitic modeling and assisting in design validation, reticle experiments, and required tape-out revisions.
  • Collaborate with layout teams to meet floorplanning, placement, and routing requirements.
  • Simulate and verify designs using industry-standard tools (e.g., FineSim, HSPICE, Verilog).
  • Perform extensive power delivery network analysis and optimization.
  • Assist in running various design checks prior to initial tapeouts and revision tapeouts.
  • Maintain technical expertise through continuous training and cross-group communication.
  • Drive innovation for future memory generations in a dynamic, collaborative environment.
  • Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption.
  • Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products.
  • Engage with Standards, CAD, modeling, and verification groups to ensure the design quality.
  • Review and check design specifications to ensure high quality.
  • Partner with Product Engineering, Test, Probe, Process Integration, Assembly, and Marketing to ensure manufacturability and performance.
  • Mentor new college graduate and experienced hires.
  • BS or MS in Electrical Engineering or a related equivalent field.
  • Proven relevant experience of 8+ year with BS or 6+ year with MS.
  • Extensive knowledge of CMOS circuit design and good understanding of semiconductor device physics.
  • Experience with schematic entry, digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations.
  • Good understanding of timing/area/power/complexity trade-offs in DRAM or mixed-signal design.
  • Familiarity with DRAM operation and JEDEC specifications, preferably with the HBM product family.
  • Experience in power delivery network analysis and optimization.
  • Experience delivering highly technical solutions.
  • Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other team members and leadership.
  • A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.
  • Excellent problem-solving and analytical skills.
  • Experience with scripting languages (Python, TCL, Perl, etc.)
  • Proven track record of innovation and problem-solving in high-performance memory development.
  • Prior experience with RTL Design flow, in DRAM process or Foundry process.
  • Choice of medical, dental and vision plans.
  • Benefit programs that help protect your income if you are unable to work due to illness or injury.
  • Paid family leave.
  • Robust paid time-off program.
  • Paid holidays.
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