Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability! HBM product family is growing due to high demand from industry leading semiconductor companies. As a HBM Memory Design Engineer in sustaining role you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will interact with the architecture team to understand new or modified specification requests, and you will work with the team on implementing and verifying the design, supporting the design release to silicon and all future needs arising for the design. You will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM products.