Staff Integration Engineer

PsiQuantum • Albany, NY

2d

About The Position

PsiQuantum is building the world’s first commercially viable quantum computer powered by silicon photonics. Our Foundry Engineering team partners with leading semiconductor manufacturers to co-develop advanced silicon-based photonic platforms that enable scalable quantum systems. In this role, you will lead the development and integration of optical interposer and advanced packaging technologies that form the foundation of PsiQuantum’s photonic quantum architecture. This work spans wafer-level processing, heterogeneous integration, packaging co-design, and materials development to deliver high-yield, high-performance optical interfaces connecting photonic and electronic subsystems. The ideal candidate will have deep experience in optical interposer process integration , including photonic waveguide integration, optical I/O coupling, and wafer-level packaging. You will collaborate closely with PsiQuantum’s design, packaging, and foundry partners to bring next-generation optical interconnect technologies from concept to production readiness.

Requirements

• M.S. or Ph.D. in Electrical Engineering, Materials Science, Applied Physics, or a related field.
• 10+ years of experience in semiconductor or photonic process integration, optical packaging, or heterogeneous photonic integration.
• Proven experience in optical interposer development , including silicon photonics, glass/silicon interposer platforms, or wafer-level photonic packaging.
• Familiarity with optical coupling techniques (fiber attach, grating couplers, lens alignment) and low-loss photonic integration processes.
• Demonstrated ability to manage cross-functional development programs with external foundry and OSAT partners.
• Experience with inline optical metrology , wafer-level testing, yield improvement, and defect reduction.
• Excellent communication and problem-solving skills, with a hands-on approach and ability to thrive in a fast-paced, collaborative setting.

Nice To Haves

• Understanding of advanced packaging technologies , including hybrid bonding, chiplet integration, or co-packaged optics, is strongly preferred.
• Track record of developing and transferring new process modules from R&D to pilot or production environments.

Responsibilities

• Lead the process development and integration of optical interposer modules, including photonic waveguide layers, and precision optical coupling structures.
• Develop and qualify wafer-level processes for photonic and optoelectronic integration, including alignment, bonding, and encapsulation for optical performance and reliability.
• Define design rules, process assumptions, and wafer acceptance criteria for optical interposer and packaging modules.
• Drive co-design across photonic, electrical, and mechanical domains to optimize performance, manufacturability, and yield.
• Partner with foundry and packaging vendors to develop optical I/O solutions, such as fiber attach, and photonic–electronic co-packaging.
• Analyze inline metrology, optical loss measurements, and defect data to identify and resolve yield limiters.
• Establish process controls, statistical methods (Cp/Cpk), and reliability test protocols for new optical and packaging modules.
• Collaborate with multi-disciplinary teams to support materials selection, tool evaluation, and computational modeling for next-generation optical integration schemes.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 501-1,000 employees