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The Heterogeneous Integration Group (HIG) is a division within the Technology and Products Group (TPG). We are developing High Bandwidth Memory (HBM) solutions for AI and ML applications. Using TSV (Through Silicon Via), we stack multiple DRAM chips on a high-speed memory controller with an integrated logic chip in one package, significantly increasing memory density and bandwidth through parallelization. Our ultimate goal is to deliver the lowest power per bit solutions in the industry. We are seeking a highly skilled and motivated PDK Enablement Engineer to join our team! The ideal candidate will be responsible for providing technical support and expertise in Process Design Kits (PDKs) to ensure smooth and efficient design workflows. This role involves close collaboration with design teams, tool vendors, and foundries to resolve issues and optimize PDKs for various design projects.