Staff Engineer, RF Engineering

Analog DevicesDurham, NC
1d

About The Position

The Advanced Data Converter group is seeking an intelligent and versatile RF designer to join the RFIC and IC/package co-design team, enabling state-of-the-art performance for the world’s highest performing RF data converters.

Requirements

  • MS with 10yr or PhD degree with 5yr experience in EE or ECE or equivalent
  • Strong background in electromagnetic static and dynamic concepts
  • Familiarity with High-speed Analog and RF circuit signal and power integrity requirements
  • Strong analytical and problem-solving skills
  • Strong team worker with multi-discipline and multi-cultural environments
  • Capable of clear, accurate and timely communication both written and verbal
  • Experience with RF EDA tools such as: Cadence Allegro, Cadence Clarity, Ansys 3D Layout, Ansys HFSS, ADS RFPro and Momentum
  • For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Nice To Haves

  • High-speed Analog and RF circuit familiarity, with emphasis on electromagnetic concepts
  • Familiarity of manufacturing processes for advanced flip-chip and fanout package technologies

Responsibilities

  • Design, analysis and model extraction of RF multi-chip packages for high-performance, mixed-signal product line with RF inputs up to 40 GHz.
  • Designs include complex power delivery networks for data transceivers operating up to 48Gsps with multiple isolated power domains
  • RF probe measurements for performance verification
  • Design, analysis and model extraction for on-chip components such as filters, balun, transmission lines and matching networks
  • Consult and contribute to package technology development with industrial and government partners for next-generation chiplet-based products.
  • Mentor junior engineers in electromagnetic theory and microwave design techniques
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