Staff Engineer, Hardware Repair and Service Engineering

Palo Alto Networks•Austin, TX

18d•$109,000 - $177,000•Onsite

About The Position

We are seeking a highly experienced and technically proficient Sr.Staff Engineer, Hardware Repair & Service Engineering to serve as the technical authority for all post-sale support, repair, and refurbishment activities for our hardware products. This role is crucial for maximizing product uptime, minimizing the total cost of service, and driving continuous product quality improvements based on real-world field failure data. The Sr. Staff Engineer will lead the development of global repair strategies and act as the primary liaison between the Service organization and the R&D/Quality teams.

Requirements

Education: Bachelor’s or Master’s degree in Electrical, Mechanical, or Industrial Engineering.
Experience: Minimum of 8+ years of experience in a hardware environment, with at least 6 years dedicated to Post-Sale Service, Failure Analysis, and Repair Engineering for high-reliability or high-volume products.
Expertise in failure analysis methodologies (RCA)
Proven ability to define, scope, and deliver automated test and repair solutions.
Strong statistical analysis skills used to analyze field data, yield rates, and MTBF.
System Knowledge: Proficiency with RMA systems, inventory management, and utilizing data from ERP (e.g., SAP) and PLM systems.

Nice To Haves

Experience developing and implementing global service strategies across multiple continents or outsourced partners.

Responsibilities

Repair Process Development & Optimization (Primary Focus)
Global Repair Strategy: Define, document, and validate the multi-tiered global repair and refurbishment processes (e.g., component-level repair, sub-assembly replacement, full unit refurbishment) to ensure high quality, rapid throughput, and optimal cost-efficiency at both internal and third-party repair depots.
Diagnostic Tooling: Validation of all specialized diagnostic software, test fixtures, and repair tools required by service technicians to accurately troubleshoot and repair product failures.
Service BOM & Parts Planning: Work directly with Supply Chain and Service Planning teams to define the correct Service Bill of Materials (SBOM), identify field-replaceable units (FRUs), and provide technical input for initial spares and critical part stocking levels.
Technical Documentation: Create, review, and maintain all technical repair instructions, troubleshooting guides, fault isolation procedures, and training content used by global service technicians.
Reliability & Failure Analysis
Closed-Loop Feedback: Establish and manage a robust closed-loop system for collecting, analyzing, and reporting field failure data (RMA data). Use statistical analysis to identify systemic failure modes and track Mean Time Between Failures (MTBF).
Root Cause Analysis (RCA): Lead complex, high-priority failure analysis investigations on returned units to determine the true root cause of failure (e.g., manufacturing defect, design flaw, field usage).
Design for Serviceability (DFS): Act as the principal technical advocate for the service organization, collaborating closely with R&D to implement design changes that reduce the complexity of repair, lower parts consumption, and minimize the total service cost of future products.
Engineering Change Order (ECO) management. Represent repair and service for all things related to change orders.
Core Component Responsibility
This role requires specific hands-on expertise in the failure analysis and repair of the following types of hardware components and sub-assemblies:
Printed Circuit Board Assemblies (PCBA): Diagnosing failures on multilayer boards, including component-level failure identification (ICs, FPGAs, passive components), solder joint integrity inspection, and rework procedures.
Power Management Systems: Analyzing failures in AC/DC power supplies, battery management systems (BMS), and voltage regulators. This includes understanding thermal characteristics and power-related failure modes.
Opto-Mechanical Assemblies: Troubleshooting issues related to complex imaging systems, laser modules, or display units where precise alignment, calibration, and sensor integrity are critical.
Electromechanical Systems: Analyzing wear-and-tear and failure modes in actuators, motors, fans, heatsinks, and complex connector systems that involve both electrical and mechanical components.
Chassis Management: Assessing failure related to structural integrity, enclosure rigidity, and the performance of thermal solutions like fans, liquid cooling systems, and thermal interface materials.