Sr. Workforce Development Engineer, TPG

Micron Technology • Boise, ID

2h

About The Position

As a Workforce Development Engineer, you will: Collaborate with engineering, manufacturing, and leadership to design and deliver technical training programs. Conduct needs assessments to identify short- and long-term training requirements across the global TPG organization. Develop and maintain engaging course content and supporting resources. Evaluate training effectiveness and continuously improve learning experiences. Partner with global sites to share and adapt training materials for cross-site implementation. Occasionally travel to support global training initiatives. Understands complex technical concepts and can communicate them clearly to diverse audiences. Has experience in course development and facilitation. Possesses advanced computer skills and uses AI tools to enhance training content and streamline tasks. Demonstrates strong analytical, critical thinking, and problem-solving skills. Excels in project management and can juggle multiple priorities effectively. Has excellent written and interpersonal communication skills. Is self-directed, proactive, and highly motivated. Experience with 3D Solid Geometry Modeling (3DSGM) is a plus. BS/MS in Engineering, Science, or Mathematics. Three-plus years of experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging. Position level will be determined based on education and experience.

Requirements

• Understands complex technical concepts and can communicate them clearly to diverse audiences.
• Has experience in course development and facilitation.
• Possesses advanced computer skills and uses AI tools to enhance training content and streamline tasks.
• Demonstrates strong analytical, critical thinking, and problem-solving skills.
• Excels in project management and can juggle multiple priorities effectively.
• Has excellent written and interpersonal communication skills.
• Is self-directed, proactive, and highly motivated.
• BS/MS in Engineering, Science, or Mathematics.
• Three-plus years of experience in semiconductor manufacturing, preferably in DRAM, HBM or Advanced Packaging.

Nice To Haves

• Experience with 3D Solid Geometry Modeling (3DSGM) is a plus.

Responsibilities

• Collaborate with engineering, manufacturing, and leadership to design and deliver technical training programs.
• Conduct needs assessments to identify short- and long-term training requirements across the global TPG organization.
• Develop and maintain engaging course content and supporting resources.
• Evaluate training effectiveness and continuously improve learning experiences.
• Partner with global sites to share and adapt training materials for cross-site implementation.
• Occasionally travel to support global training initiatives.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees