Sr. Staff Packaging Engineer

Qualcomm • San Diego, CA

80d • $180,400 - $270,600

About The Position

Come join us and create what has yet to be imagined. Qualcomm invents foundational technologies that transform how the world connects, computes, and communicates. We are a brand of inventors for innovators. When we break through, the world leaps forward. In this highly visible role, you will be responsible for developing advanced 2.5D packaging technologies and defining baseline assembly processes that are optimized for performance, reliability, yield, and cost across multiple product application spaces for high performance computing. Extensive knowledge and experience in 2.5D package technology development including architecture definition, assembly processes, thermal-mechanical, materials, and chip-package-interactions are required. This position also requires the ability to lead cross-functional teams, manage multiple foundries and OSATs, and resolve complex technical issues.

Requirements

• Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 6+ years of System/Package Design/Technology Engineering or related work experience.
• OR Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 5+ years of System/Package Design/Technology Engineering or related work experience.
• OR PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 4+ year of System/Package Design/Technology Engineering or related work experience.

Nice To Haves

• M.S. in Mechanical, Electrical or Materials Engineering or equivalent.
• 10+ years of hands-on experience in packaging technology development in assembly of IC packages including PoP, SiP, 2/2.5D.
• Understanding semiconductor industry packaging trends, end-user packaging considerations, and previous experience with high performance computing products.
• Knowledge of reliability standards, test methods, qualification procedures, and failure analysis techniques.
• Familiarity with substrate manufacturing processes and design rules.
• Excellent verbal and written communication skills.
• Demonstrated organized technical project management skills.
• Ability to work independently and lead multiple programs.
• Ability to lead multi-functional teams to solve complex technical problems.

Responsibilities

• Hand on experience with large body size FCBGA/LGA, FCCSP assembly including die prep, chip attach, underfill, lid/stiffener attach, ball attach, process optimization, material selection, DOE planning, execution, and data analysis.
• Strong analytical, project management and communication skills working with internal and external cross function teams.
• Additional experience and knowledge on ABF buildup substrate, EMIB, design and wafer bumping processes is a plus.
• Work with OSAT, material and equipment suppliers to bring up new process along with driving NPI and HVM deployment.
• Working with X-functional team to drive packaging structures.

Benefits

• $180,400.00 - $270,600.00 salary range.
• Competitive annual discretionary bonus program.
• Opportunity for annual RSU grants.
• Highly competitive benefits package designed to support success at work, at home, and at play.

What This Job Offers

• Number of Employees: 5,001-10,000 employees