Sr. Signal and Power Integrity Engineer

Microsoft • Raleigh, NC

391d • $117,200 - $229,200

About The Position

The Senior Signal Integrity and Power Integrity (SIPI) engineer will be part of the Microsoft Azure hardware engineering team, focusing on developing advanced power delivery and signaling solutions for High Performance Computing (HPC) silicon designs. This role involves driving SIPI design solutions that support overall System on Chip (SoC) performance, collaborating with various teams including silicon, packaging, and system design to ensure optimized performance across Microsoft systems such as Azure, Xbox, and HoloLens.

Requirements

• 7+ years of related technical engineering experience OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience or internship experience OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field.
• 5+ years of experience in silicon/package/system signal integrity and power delivery.
• Working knowledge in the field of end-to-end system SIPI Design and Architecture.
• Industry knowledge, trends and landscape of technologies to drive development across Silicon-IP, Advanced packaging, Substrate technology, Board technology and Platform design.

Nice To Haves

• 11+ years technical engineering experience OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 8+ years technical engineering experience OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.
• 10+ years' experience in silicon packaging products development.
• Experience with high-speed signal design and/or power integrity modelling for HPC products.
• Strong foundation in advanced packaging technologies as it relates to Signal and Power integrity.
• Experience with Foundry Silicon technologies, OSAT technologies and Substrate technologies.
• Expertise in the field of Signal and Power Integrity and delivery, System design, IP design with knowledge on product development with minimum 5 years' experience in design and electrical modelling.
• Interpersonal skills including written and verbal communication, teamwork, negotiation, and presentation.

Responsibilities

• Implement strategies for end-to-end power delivery design and signal integrity design from Silicon to Package, linking to Platform to System and Cloud.
• Deliver SIPI solutions that meet the HPC demands across the entire system.
• Drive future power and signal integrity solutions for chiplet architecture with advanced packaging and advanced silicon nodes.
• Design, model, and simulate SI and PI for data center processors and corresponding platforms to ensure optimized performance.
• Perform DC, AC and transient simulation to provide noise, impedance profile of the whole power delivery path and validate I/O performance from platform to silicon.
• Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers.
• Drive the execution of architecture solutions across product lines or multiple product groups, leveraging cross-functional expertise and industry best practices.
• Make engineering system design decisions that require collaboration between internal and external stakeholders.

Benefits

• Health insurance
• Dental insurance
• Vision insurance
• 401k plan
• Paid holidays
• Paid time off
• Flexible scheduling
• Professional development opportunities
• Employee discount programs
• Tuition reimbursement
• Life insurance
• Disability insurance
• Mental health days
• Wellness programs

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Publishing Industries
• Education Level: Bachelor's degree