Teledyne Technologies Incorporated-posted 4 months ago
$113,600 - $151,400/Yr
Goleta, CA
5,001-10,000 employees

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. Under the general supervision of the Process Engineering Manager, coordinates and directs development, sustaining, and continuous improvement activities (output, yield, cost reduction) focused on front end (wafer level) dry etch. Defines processing and equipment requirements and specifications, and reviews techniques and methods applied in the manufacture, fabrication, and evaluation of next generation III-V infrared sensors. The selected candidate will work with a team of technicians, maintenance/equipment personnel, operations management, development and yield engineering. A strong understanding of infrared detector processes and materials is desirable, specifically involving dry etch, along with appropriate metrology techniques. Seeking candidates who exhibit a self-driven sense of urgency, effective collaboration, tolerance of ambiguity, and demonstrated ability to exercise objective technical judgement.

  • Coordinate and direct development, sustaining, and continuous improvement activities focused on front end dry etch.
  • Define processing and equipment requirements and specifications.
  • Review techniques and methods applied in the manufacture, fabrication, and evaluation of infrared sensors.
  • Work with a team of technicians, maintenance/equipment personnel, operations management, development and yield engineering.
  • Design, execute, and status production and development experiments.
  • Present technical findings to key technical and non-technical stakeholders.
  • Document and own area work instructions, job aids, training/certification, and production/operational standards.
  • Apply structured problem solving to excursions, capacity constraints, and yield improvements.
  • Collaborate and troubleshoot alongside upstream and downstream process owners and modules.
  • Partner with external vendors to specify, evaluate, and justify capital processing and metrology equipment.
  • M.S. or equivalent in a STEM field.
  • Minimum 2 years of direct semiconductor processing experience.
  • Strong familiarity with process and equipment involving dry etch (ICP/RIE) and ancillary processes.
  • Experience with PlasmaTherm Versaline toolsets.
  • Proven ability to tie theoretical principles to functional process and equipment improvements.
  • Experience with Statistical Process Control (SPC) and Design of Experiments (DOE/ANOVA).
  • Strong understanding of material/chemical safety data and ability to follow safety protocols.
  • Ability to work in a cleanroom environment wearing full coverall garments for extended periods.
  • Experience with formal DOE creation, execution, and analysis.
  • Experience with MES systems in a medium volume, high mix, semiconductor manufacturing environment.
  • Experience with phase gate release methodologies (NPI, phased LRIP).
  • Competitive salary based on experience and qualifications.
  • Commitment to ethical standards and compliance with laws and regulations.
  • Equal Opportunity/Affirmative Action Employer.
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