Teledyne Technologies Incorporated-posted 4 months ago
$113,600 - $151,400/Yr
Mid Level
Goleta, CA
5,001-10,000 employees

Teledyne Technologies Incorporated provides enabling technologies for industrial growth markets that require advanced technology and high reliability. These markets include aerospace and defense, factory automation, air and water quality environmental monitoring, electronics design and development, oceanographic research, deepwater oil and gas exploration and production, medical imaging and pharmaceutical research. We are looking for individuals who thrive on making an impact and want the excitement of being on a team that wins. Teledyne FLIR is committed to enhancing the careers of our employees by providing a variety of internal opportunities for advancement. Whether the opportunity is advancing in your current field of expertise or trying something new, Teledyne FLIR is a great place to explore the possibilities and we are looking forward to continuing the journey with you. Applicants must be either a U.S. citizen or PERM Resident.

  • Coordinate and direct development and integration of cross module processes and equipment sets.
  • Responsible for new product/process introduction & integration (NPI) spanning wafer epitaxial growth through final sensor test.
  • Define processing or handling equipment requirements and specifications.
  • Review front & backend processing techniques and methods applied in the manufacture, fabrication, and evaluation of III-V semiconductor sensor devices.
  • Collaborate with a team of research/engineering technicians, process/yield/test engineers, device physicists, maintenance/equipment personnel, & operations management.
  • Participate in technology advancement for engineering wafer and/or focal plane array fab processes including photolithography, dry and wet etch, passivation, evaporative deposition, thin film coatings and/or anneal, hybridization, thinning, and/or characterization.
  • Design, execute, and status production and development experiments.
  • Present technical findings to key stakeholders.
  • Apply structured problem solving (Kepner Tregoe, DMAIC, 8D, etc.) to address process/equipment excursions, capacity constraints, and yield improvements.
  • Engage external vendors to specify, evaluate, and justify capital processing and metrology equipment.
  • Facilitate gated release into production.
  • B.S. or equivalent in a science or a related field, M.S. or PhD preferred.
  • Direct experience with SQL, Python, JMP, and MATLAB.
  • Minimum 2 years of direct semiconductor processing experience.
  • Clear verbal and written communication.
  • Strong working knowledge of semiconductor device physics, infrared detector preferred.
  • Ability to work in a cleanroom environment wearing full coverall garments for extended periods.
  • Experience using MES systems in a medium volume, high mix, semiconductor manufacturing environment.
  • Demonstrated understanding of material/chemical safety data and ability to follow safety protocols & regulations.
  • Experience with phase gate release methodologies (NPI, phased LRIP, PFMEA, control plan, or equivalent).
  • Competitive salary based on experience and qualifications.
  • Opportunities for internal advancement.
  • Collaborative and supportive work culture.
© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service