Sr. Principal RF Microwave Design Engineer

Northrop Grumman-posted 3 months ago
$131,300 - $196,700/Yr
Full-time • Senior
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At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Space Systems sector delivers a decisive advantage to its customers through software-defined, hardware-enabled solutions. The Electrical Design and Analysis (EDA) section in Linthicum, MD enables these hardware solutions by providing technical expertise in the areas of architecture development, design, verification, and testing across a wide variety of electronic sensor products. Our engineers work on complex, leading edge, high reliability electronics supporting different space platforms. NGSP engineers share a great sense of pride knowing their contributions have a direct effect on the safety and security of the country and its allies. Our culture thrives on intellectual curiosity, cognitive diversity, teamwork, and bringing your whole self to accomplish the mission while learning and having fun along the way.

  • Developing, planning, executing, and overseeing the integration and test activities for payload RF electronics subsystems.
  • Troubleshooting RF subsystems and mixed-signal assemblies based on schematics and component design documents utilizing various test equipment.
  • Ensuring the hardware meets performance, functional, interface and requirements before delivery to Payload level.
  • Coordinating with Electronic Circuit Assembly (ECA) designers, systems engineers, and test equipment team to ensure readiness.
  • Managing HW/SW/FW integration at the sub-system level.
  • Developing and executing detailed test procedures to verify functionality and interfaces.
  • Participating in design reviews, Test Readiness Reviews (TRRs) and formal verification activities.
  • Supporting payload level integration with higher level assemblies and tests.
  • Supporting Low-Rate Space Production.
  • Leading testing and reporting activities.
  • Managing technician workload and priorities.
  • Developing test plans and managing its execution.
  • Maintaining and coordinating calibration of test equipment.
  • Interfacing customers and providing support as needed.
  • Hands on integration and test support.
  • Collaborating with cross functional groups to achieve desired outcome (management, engineering, reliability, mission assurance and production personnel).
  • Open to occasional shift support during pre-environmental testing (PET) and Thermal vacuum testing (TVAC) for system testing.
  • Bachelor’s degree in electrical engineering or comparable STEM degree.
  • Minimum of 8 years of relevant engineering experience (6+ years with MS degree; or 3+ years with PhD).
  • Experience translating customer/system requirements into I&T plans, procedures, verification matrices and test scripts while addressing compliance at the product, component, and system levels.
  • Experience providing or presenting I&T tests, plans, activities or status at program reviews or technical meetings.
  • Ability to read and interpret schematics, assembly drawings, parts lists.
  • Demonstrated ability to analyze and troubleshoot RF subsystems, complex mixed-signal ECAs and RF modules using schematics, component design documents, and basic lab test equipment.
  • Design, create, and modify Electrical Ground Support Equipment (EGSE) to support I&T activities.
  • Ability to provide solutions to a broad variety of RF/Microwave design and test related problems of complex difficulty.
  • Demonstrated Technical Team Leadership and ability to work on multi-disciplined engineering teams and communicate clearly within integrated product team (IPT) leads.
  • Basic understanding of the Design, Manufacturing, and Test process.
  • Exhibit intermediate to expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. ANSYS HFSS/Maxwell, CST Microwave, Eagleware/Genesys, Keysight ADS, Xpedition, Altium, FEKO, TICRA).
  • Proficient in RF/Microwave and mixed signal circuit design, schematic capture, and PWB/board layout.
  • Completed and/or led multiple board designs from schematic capture to board release.
  • Easily adapt to design challenges to meet program goals and deadlines.
  • Effective verbal and written communication.
  • US Citizenship is required.
  • Must have a Secret clearance at time of application with the ability to obtain and maintain a TS/SCI.
  • Active TS/SCI security clearance.
  • Ability to create Design & Test Requirement documents and Operational Test Specifications.
  • Expert proficiency with industry standard RF/Microwave modeling, simulation and printed circuit board design tools (e.g. Keysight ADS, Xpedition, Altium).
  • Fluency with developing and executing technical development plans.
  • Experience Integrating a system containing digital hardware, software and firmware.
  • Experience as technical lead or other similar leadership role with demonstrated team building, organizational, and interpersonal skills.
  • Test Coordination Experience with standard test equipment (STE) design or support.
  • Experience with environmental stress screening (ESS) including TVAC.
  • Ability to troubleshoot Test bench issues from H/W and S/W documentation.
  • Ability to manage technician workload and priorities.
  • Ability to assess and generate reports for electrical over stress analysis.
  • Expertise in working with receiver/exciters, conducting RF performance analysis, and implementing digital beamforming.
  • Design, develop, creation and modification of test scripts utilizing (FPGAs) Xilinx and Microchip FPGAs.
  • Experience with scripting languages such as TCL, Python or Perl.
  • Embedded networking or high-speed protocols experience (Ethernet, PCIe, Interlaken, Infiniband, etc.).
  • Experience in Worst Case Circuit Analysis (WCCA) including logic compatibility, component derating, timing analysis, signal and power integrity analyses.
  • Signal integrity analysis (SERDES, Bit error rates, jitter components and contributors, board to board analysis).
  • Experience in integrating FPGA/Digital controls on the bench (no VHDL experience required).
  • Understanding of basic signal processing RF budgeting, frequency planning, RF chain analysis and modeling.
  • Health insurance coverage.
  • Life and disability insurance.
  • Savings plan.
  • Company paid holidays.
  • Paid time off (PTO) for vacation and/or personal business.
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