Sr Principal Engineer Microelectronic Process

Northrop Grumman

94d • $131,100 - $196,700

About The Position

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Mission Systems is seeking an accomplished Senior Principal Microelectronics Engineer based out of Linthicum, MD to lead advanced packaging and microelectronics assembly initiatives for high-reliability, mission-critical systems. Advanced Technology Lab (ATL) - located outside of Baltimore, Maryland – is where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry has unique capabilities supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable several Northrop Grumman’s ground-based radars, avionic radars, and space systems. Join us for the chance to work with an experienced and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in production, R&D, ongoing long-term programs, and new programs targeting future military platforms.

Requirements

• Bachelor’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field and 8+ years of experience in microelectronics packaging, or 6+ years with a Master’s degree, or 4+ years with a PhD.
• Hands-on and leadership experience with eutectic die attach, thermosonic wire bonding (Au/Al), hermetic encapsulation/seam sealing, and laser dicing.
• Strong understanding of high-reliability manufacturing standards (MIL-STD-883, MIL-PRF-38535, NASA/ESA packaging guidelines).
• Experience working in a production or manufacturing environment and generating specifications for procurement of new equipment.
• Proven ability to lead cross-functional teams, interface with customers, and act as a technical authority.
• Active or ability to obtain a U.S. DoD Secret clearance.

Nice To Haves

• Master’s or PhD in Mechanical Engineering, Materials Science, or related discipline.
• 12+ years of experience in semiconductor/microelectronics packaging for space, defense, or medical devices.
• Knowledge of mechanical manufacturing and production processes.
• Familiarity with hermeticity testing (helium fine/gross leak), destructive physical analysis, and long-term reliability qualification.
• Experience applying SPC, DOE, FMEA, and Lean Six Sigma methodologies in packaging environments.
• Direct experience with supplier oversight, equipment qualification, and government/customer audits.
• Recognized as a Subject Matter Expert (SME) in packaging for aerospace/defense programs.

Responsibilities

• Bring your comprehensive understanding of semiconductor die packaging—from wafer preparation through hermetic sealing and final delivery.
• Drive innovation, ensure compliance to space and defense standards, and mentor multidisciplinary teams.
• Utilize your deep expertise in eutectic die attach, wire bonding, hermetic encapsulation, seam sealing/lidding, and laser dicing, along with the strategic insight to integrate these processes into robust, repeatable, and cost-effective manufacturing flows.
• Provide technical leadership, system-level perspective, and cross-functional collaboration to ensure packaging solutions meet the demanding reliability requirements of aerospace and defense applications.
• Own end-to-end packaging flows, including wafer prep, laser dicing, die attach (eutectic and epoxy), pick-and-place, wire bonding, hermetic encapsulation, seam sealing, and tape-and-reel.
• Ensure all packaging processes meet MIL-STD, NASA, JEDEC, and customer specifications for high-reliability applications, including Class K space hardware.
• Provide a system-level perspective of how packaging processes interact and impact device performance, yield, and long-term reliability.
• Serve as a subject matter expert (SME) in packaging for internal teams, customer reviews, and external audits.
• Lead root cause investigations on complex yield and reliability challenges.
• Identify and champion new packaging technologies, equipment, and methodologies to improve manufacturability, throughput, and reliability.
• Partner with design engineering, reliability, operations, and program management teams.
• Author and review technical documentation, including process travelers, work instructions, and qualification reports to ensure compliance with customer and regulatory standards.

Benefits

• Health insurance coverage
• Life and disability insurance
• Savings plan
• Company paid holidays
• Paid time off (PTO) for vacation and/or personal business

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Bachelor's degree