Sr. Principal Engineer, Advanced Packaging

Marvell Technology • Austin, TX

8d

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer’s most challenging designs and integrations with industry-leading packaging technologies What You Can Expect Lead the development and optimization of advanced packaging solutions, including 2.5D/3D architectures (e.g., CoWoS, EMIB, CPO, CPC). Evaluate package and PCB designs to meet challenging electrical requirements. Collaborate closely with physical design and IP teams to optimize electrical performance. Execute SI/PI simulations and sign-off using industry-standard EDA tools. Define and drive strategic packaging initiatives aligned with Marvell’s technology roadmap. Lead design and development efforts for optoelectronic packaging, including integration of photonic components and co-design with electrical interconnects. Mentor engineers and foster a culture of innovation and knowledge sharing. Engage with cross-functional teams and external partners to influence design and manufacturing strategies. Manage package design and development programs involving global, cross-functional teams. What We're Looking For We are seeking a Senior Principal Engineer with deep expertise in advanced package technology, including signal integrity (SI), power integrity (PI), and high-performance packaging architectures. This role is ideal for a technical leader who thrives in complex design environments and is passionate about driving innovation in packaging and interconnect technologies. The ideal candidate will also have hands-on experience in the design and development of optoelectronic packaging, including integration of photonic components and high-speed electrical interfaces. This position offers significant opportunities for growth, including leading strategic packaging initiatives, mentoring engineering talent, and influencing Marvell’s technology roadmap. Leadership experience, either as a people manager or technical lead is a strong plus.

Requirements

• Bachelor’s degree in Electrical Engineering or related field with 15+ years of experience in package design, or Master’s/PhD with 10+/8+ years of relevant experience.
• Proven expertise in SI/PI fundamentals and simulation methodologies.
• Experience with EDA tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, PowerSI, SIwave.
• Familiarity with packaging technologies, substrate design rules, materials, and assembly processes.
• Strong understanding of circuit extraction and simulation workflows.
• Experience in optoelectronic packaging design and development, including photonic-electronic integration.
• Ability to perform routing feasibility studies using tools like Cadence APD or PCB Editor.
• Excellent communication, presentation, and documentation skills.
• Ability to work effectively across geographies and time zones.

Nice To Haves

• Leadership experience, either as a people manager or technical lead is a strong plus.

Responsibilities

• Lead the development and optimization of advanced packaging solutions, including 2.5D/3D architectures (e.g., CoWoS, EMIB, CPO, CPC).
• Evaluate package and PCB designs to meet challenging electrical requirements.
• Collaborate closely with physical design and IP teams to optimize electrical performance.
• Execute SI/PI simulations and sign-off using industry-standard EDA tools.
• Define and drive strategic packaging initiatives aligned with Marvell’s technology roadmap.
• Lead design and development efforts for optoelectronic packaging, including integration of photonic components and co-design with electrical interconnects.
• Mentor engineers and foster a culture of innovation and knowledge sharing.
• Engage with cross-functional teams and external partners to influence design and manufacturing strategies.
• Manage package design and development programs involving global, cross-functional teams.

Benefits

• Marvell is committed to providing exceptional, comprehensive benefits that support our employees at every stage - from internship to retirement and through life’s most important moments.
• Our offerings are built around four key pillars: financial well-being, family support, mental and physical health, and recognition.
• Highlights include an employee stock purchase plan with a 2-year look back, family support programs to help balance work and home life, robust mental health resources to prioritize emotional well-being, and a recognition and service awards to celebrate contributions and milestones.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees