The Integrated Circuit Design group at Teledyne FLIR develops the image sensors for use in a wide range of applications. Infrared image sensors designed here are used in high volume cell phone and automotive cameras to high-end performance systems for security and search and track applications. This wide range of applications and the demands for image performance leads to an ever changing and demanding set of design specifications that will keep you challenged and always looking for new and better ways to implement circuits. As Teledyne FLIR is vertically integrated, our group is involved in early system trades as well as support for camera integration and production. You will be tasked take the lead in the design and analysis of the entire chip. This includes designing the circuitry of the signal path (detector interface, amplifiers, sampling, ADCs) and support circuitry (such as biases and PLLs) from transistor level simulations to system level analysis. This also means working with digital and layout engineers to ensure the entire chip works as intended the first time. Our design teams of 3 to 5 engineers on an image sensor are small, so each engineer is responsible for the design trades and implementation of a large portion of the overall chip. While completing system level trades as well as working on the individual blocks of a design is challenging, it also results in a great sense of accomplishment when the image sensors are completed and integrated into cameras. Ultimately seeing your work used by people around the world to save lives and livelihoods in a wide range of applications allows you to see a clear purpose and take pride in your everyday work.