As a Senior Principal Applied Scientist - Thermal, you will focus on the alignment of OCI thermal hardware design with specific experience in Rack Cooling and the data center physical infrastructure. A mix of technical breadth and depth is required to work cross-functionally with different disciplines (Mechanical, Electrical, Thermal, and Software) to develop and set cooling strategies and actual HW setup that are optimized for the entire rack and effectively manage high performance data center infrastructure. You will work with internal and external partners, focusing on delivering the next generation of world class fluid-cooled hardware and data centers. Build, conduct thermal simulations, and review thermal simulation models from partners to identify data center risks and improve efficiency. Familiarization with Open Compute Design Specifications. Familiarization with Next Generation Fluid Cooling Solutions and Advanced Thermal Designs. Understanding mechanical design process to work with mechanical design engineers on all engineering development efforts Experience with mechanical validation tests process that may include, Environmental Test Engineering (ETE), Vibration testing & characterization. Familiarity with Electromagnetic Compliance (EMI/EMC) is a plus Experience in negotiating, establishing, and managing relationships with vendors Career Level - IC5
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Job Type
Full-time
Career Level
Principal