Sr. Plating Process Engineer (49077)

HEADWAY TECHNOLOGIES INC•Milpitas, CA

About The Position

Under the direction of the Director of Plating Process Development, the Sr. Plating Process Development Engineer is responsible for developing and delivering new strategies for improving and optimizing plating and wet etch process and procedures; designing and conducting moderately advanced wafer experiments, analyzing the data, and reporting the results; developing and implementing new practices or methodologies which reduce cost and improve operational efficiency; conducting root cause analysis and implementing corrective action; developing and implementing procedures for transitioning new products into the production line; and reviewing, updating, and maintaining documentation and process instructions. This position is located in Milpitas, California.

Requirements

Master’s degree in Chemical or Electrical Engineering, Materials Science, or Physics, and/or equivalent relevant experience
Six years of hands’ on experience working in the magnetic recording head, hard disk drive, or semiconductor industry in a thin film plating or process engineering role
Strong knowledge and experience using JMP, SPC, or similar software
Proficient in the use of Microsoft Office Applications
Strong knowledge of thin film plating and wet etch development and manufacturing processes, practices, and techniques
Knowledge of wafer fabrication processing techniques and tools
Knowledge and ability to use Microsoft Office applications to create spreadsheets, Word documents, and presentations
Able to design moderately complex experiments, analyze results, and recommend corrective action in order to reduce scrap and improve yield
Able to communicate effectively, both verbally and in writing, with all levels of contractors, consultants, employees, and management
Able to work productively and collaboratively with all levels of employees and management
Able to comply with all safety policies and procedures
Demonstrated organizational and time management skills
Demonstrated problem-solving and trouble shooting skills
Flexible and able to prioritize

Nice To Haves

PhD degree preferred

Responsibilities

Develops and delivers new strategies for improving and optimizing wafer plating and wet etch processes and procedures
Develops and implements new practices or methodologies which reduce cost and improve operational efficiency
Conducts root cause analysis and implements corrective action if required
Develops and implements processes or procedures for transitioning new products into the production line
Monitors and sustains prototype wafers to ensure they move through the plating or wet etch process smoothly
Reviews, updates, and maintains documentation and process instructions
May instructs operators and technicians on processes and procedures, including modifications to existing procedures
Partners with equipment and maintenance personnel in order to minimize tool down time and integrate new tools into the production line
Designs and conducts moderately advanced experiments, analyzes data, and develops recommendations for improving the performance or reducing cost based on test results
Partners with other groups and departments, including process and product engineering to develop and implement new processes which reduce scrap and improve yield
Responds to inquiries from other team members, managers, or departments
Adheres to all safety policies and procedures as required
Performs other duties of a similar nature or level