Sr. Manager Process Engineer (RF Wirebond and Epoxy)

RTX•McKinney, TX

1d•Onsite

About The Position

The Advanced Products Center (APC) Manufacturing Engineering organization is seeking a Sr. Manager Process Engineering to lead the RF Wirebond and Epoxy team of highly skilled engineers specializing in Chip and Wire processes, including epoxy dispense, pick and place, and wirebonding. This leader will drive operational excellence and innovation while fostering collaboration across teams to deliver best-in-class solutions to our customers. The Sr. Manager will work closely with APC Process Engineering Leads, Factory Managers, and Integrated Product Teams (IPTs) to ensure alignment with program and factory needs. This role emphasizes talent development, process optimization, and the application of engineering best practices to achieve operational goals and improve manufacturing outcomes. This position requires hands-on support of manufacturing operations, with significant time spent in and around the factory floor to ensure seamless production processes and immediate resolution of issues.

Requirements

Typically requires a Bachelor’s degree in Science, Technology, Engineering, or Mathematics (STEM) and a minimum of 10 years of prior relevant experience
10+ years of leadership experience in manufacturing or process engineering

Nice To Haves

Demonstrated ability to lead teams in a fast-paced manufacturing environment, resolve complex technical challenges, and deliver results
Extensive experience in Chip and Wire manufacturing processes, including epoxy dispense, pick and place, and wirebonding, with a focus on optimization, defect reduction, and quality assurance in high-reliability manufacturing environments
Leadership experience managing technical teams, fostering collaboration, and driving operational excellence and continuous improvement initiatives
Proven experience mentoring and developing engineering talent, providing career development guidance, and aligning team capabilities with organizational needs
Familiarity with lean manufacturing, CORE methodology, and advanced problem-solving frameworks
Experience in a highly regulated manufacturing environment, with a proven ability to implement and maintain compliance with industry standards and regulatory requirements
Strong communication skills, with the ability to effectively engage with all levels of management and individual contributors across multiple locations

Responsibilities

Lead and supervise the RF Wirebond and Epoxy team of 15-20 engineers specializing in Chip and Wire processes (epoxy dispense, die attach/pick and place, and wirebonding), ensuring effective collaboration and alignment with business objectives
Develop and communicate clear, measurable goals for the team, focusing on process improvements, quality, and efficiency in Chip and Wire operations
Provide technical leadership and support for the development, optimization, and implementation of manufacturing processes related to Chip and Wire technologies
Drive continuous improvement initiatives using lean manufacturing, CORE methodology, and advanced problem-solving techniques to enhance production efficiency and quality
Actively support factory operations by spending time on the production floor, resolving issues promptly, and fostering a culture of accountability and operational excellence
Monitor manufacturing data to identify and address defect trends and areas for improvement in Chip and Wire processes
Ensure compliance with industry standards and regulatory requirements while implementing process changes and verifying performance
Conduct performance reviews, mentor engineers, and support hiring efforts to meet staffing and skill requirements
Travel to other facilities, suppliers, and industry conferences to stay current on advancements in Chip and Wire technologies and best practices