About The Position

AWS Utility Computing (UC) provides product innovations — from foundational services such as Amazon’s Simple Storage Service (S3) and Amazon Elastic Compute Cloud (EC2), to consistently released new product innovations that continue to set AWS’s services and features apart in the industry. As a member of the UC organization, you’ll support the development and management of Compute, Database, Storage, Internet of Things (Iot), Platform, and Productivity Apps services in AWS, including support for customers who require specialized security solutions for customers who require specialized security solutions for their cloud services. Annapurna Labs (our organization within AWS UC) designs silicon and software that accelerates innovation. Customers choose us to create cloud solutions that solve challenges that were unimaginable a short time ago—even yesterday. Our custom chips, accelerators, and software stacks enable us to take on technical challenges that have never been seen before, and deliver results that help our customers change the world. We are seeking a Hardware Design Engineer with role in the definition, design and validation of AWS next generation ML Chips, Cards and server integration. As a senior member of our hardware team, you will have the outstanding and meaningful opportunity to participate in the design and execution of all PCIe and Serdes topics, with the goal of creating and customized platforms that fit within AWS datacenter’s world leading technology. As a member of the Machine Learning Acceleration team you’ll be responsible for the design and optimization of hardware in our data centers. You’ll provide leadership in the application of new technologies to large scale server deployments in a continuous effort to deliver a world-class customer experience. This is a fast-paced, intellectually challenging position, and you’ll work with thought leaders in multiple technology areas. You’ll have high standards for yourself and everyone you work with, and you’ll be constantly looking for ways to improve your products performance, quality and cost. We’re changing an industry, and we want individuals who are ready for this challenge and want to reach beyond what is possible today.

Requirements

  • Experience in developing functional specifications, design verification plans and functional test procedures
  • Bachelor's degree in Electrical or Mechanical Engineering or related field.
  • 6+ years of experience in connector or cable assembly design for high-speed applications.
  • Deep understanding of server backplane cable technologies including twinax, DAC, fiber, and hybrid solutions.
  • Hands-on experience with high-speed connector technologies (e.g., SFP/QSFP, MCIO, EDSFF, OCP standards).
  • Strong fundamentals in signal integrity, including channel loss, crosstalk, impedance, and return loss.
  • Proficiency in mechanical and electrical CAD tools (e.g., Creo, SolidWorks, Allegro).
  • Excellent written and verbal communication skills.

Nice To Haves

  • High speed PCB design experience is a plus.
  • Master's degree in electrical engineering, computer engineering, or equivalent
  • Experience working with interdisciplinary teams to execute product design from concept to production
  • Experience with the project management of technical projects
  • Experience working with hyperscale compute, data center, or storage hardware.
  • Knowledge of SI simulation tools (e.g., Ansys HFSS, Keysight ADS) is a plus.
  • Familiarity with industry standards such as PCIe, SAS, SATA, IEEE, or OCP.
  • Demonstrated success in vendor management and supplier development programs.
  • Ability to work in a fast-paced, ambiguous, and collaborative environment.

Responsibilities

  • Lead the design, evaluation, and release of server backplane and cable interconnect solutions for high-performance compute systems.
  • Own end-to-end development of high-speed connectors, including definition, selection, 3D modeling, simulation review, and mechanical integration.
  • Collaborate with electrical, mechanical, and system architects to ensure interconnect designs meet signal integrity (SI), power integrity (PI), and thermal requirements.
  • Manage relationships with connector and cable vendors: including spec alignment, technical reviews, and performance validation.
  • Apply fundamental signal integrity principles to optimize high-speed links and reduce EMI/EMC challenges.
  • Drive connector and cable manufacturing processes, including DFM, tooling, assembly techniques, and quality control.
  • Support failure analysis, root cause investigations, and field issue resolutions related to interconnect systems.

Benefits

  • Amazon is a total compensation company. Dependent on the position offered, equity, sign-on payments, and other forms of compensation may be provided as part of a total compensation package, in addition to a full range of medical, financial, and/or other benefits. For more information, please visit https://www.aboutamazon.com/workplace/employee-benefits .

Stand Out From the Crowd

Upload your resume and get instant feedback on how well it matches this job.

Upload and Match Resume

What This Job Offers

Job Type

Full-time

Career Level

Mid Level

Number of Employees

5,001-10,000 employees

© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service