Sr Engineer, Thin Films Development, Wafer Level Bonding

Micron Technology

70d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Do you have experience in depositing thin films and thrive in a fast paced, results oriented and collaborative environment? At Micron, we solve challenging tactical and technical problems meeting the demands of our fast-paced and dynamic development environment! As a Films Process Development Engineer in Micron’s Advanced Packaging area, you will develop and optimize novel solutions to film deposition challenges for the next generations of Micron’s memory systems including HBM. You will be able to take ideas from conception, through development to deployment in manufacturing. We offer a highly collaborative and innovative atmosphere, allowing you to interact with various groups including process integration, electrical failure analysis, yield enhancement, manufacturing and various semiconductor equipment manufacturers. We have the goal to ensure the robust solutions to thin film challenges that meet the detailed physical and electrical requirements for Micron’s industry leading memory products. You will have the opportunity to drive and define Micron’s thin film technology roadmaps and generating intellectual property which will have a direct influence on Micron’s global leadership in semiconductor manufacturing.

Requirements

• Ph. D. (or equivalent education) in Materials Science, Chemical Engineering, Chemistry, Physics, or other related technical fields.
• Extensive process development experience may substitute for Ph. D.
• Hands on experience of thin film deposition and characterization.
• Understanding of growth and characterization of thin films.
• Knowledge of thermodynamics, chemical kinetics and their direct application to films deposition; plasma processing and its impact on film properties are plus.
• Strong analytical and creative problem-solving skills, and experience using extensive technical knowledge to guide decisions and strategies for a project.
• Ability to resolve complex issues through root-cause or model-based problem solving.

Nice To Haves

• Ability to work independently, with minimal direction, a focus on meeting commitments, and the ability to manage numerous projects simultaneously.
• The ability and willingness to learn new skills as needed.
• Experience in programming or scripting is desirable.
• Knowledge of semiconductor processing, solid-state device physics, and of thin film deposition or plasma physics is desirable.
• Proficiency with data analysis, DOE, and statistical techniques is assumed.
• Data science experience is a plus.

Responsibilities

• Develop, optimize and characterize thin film processes to meet the requirements of pioneering advanced packaging products.
• Perform fundamental research to drive innovative solutions for next-generation products.
• Collaborate with process integration and other process development teams to develop innovative solutions.
• Optimize deposition processes to reduce cost, process variability, GHG emissions, and improve process capability.
• Conduct root cause and failure mode analysis to understand the limitations of current hardware and drive vendors for solutions.
• Maintain a technology development pilot manufacturing line.
• Support process transfer to production facilities (some minimal travel may be required).

Benefits

• Choice of medical, dental and vision plans.
• Benefit programs that help protect your income if you are unable to work due to illness or injury.
• Paid family leave.
• Robust paid time-off program.
• Paid holidays.

What This Job Offers

• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees