Sr. Engineer, Advanced Packaging, TD
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About The Position
Micron Technology is seeking a highly skilled and experienced Electroplating Engineer to join our Advanced Packaging team in Boise, Idaho. The ideal candidate will possess extensive experience with copper pillars, binary and ternary metallurgies, and gold plating processes. This role is critical in researching, developing, and overseeing plating operations, ensuring that all processes meet high-quality standards while optimizing for efficiency and effectiveness. The successful candidate will play a key role in advancing our plating technologies and processes, contributing to the overall success of our semiconductor manufacturing operations. In this position, you will oversee and manage various plating processes, including copper, tin-silver, and gold plating. You will be responsible for developing effective process control methods to ensure that all plating operations meet stringent quality standards and specifications. Troubleshooting will be a significant part of your role, as you will need to identify and resolve issues in the plating process to minimize downtime and defects. Continuous improvement will be a focus, as you will work to enhance efficiency, reduce waste, and lower costs associated with plating operations. You will also ensure that all plating equipment is properly qualified and calibrated, adhering to all safety regulations and protocols to maintain a safe working environment. Accurate documentation of plating processes, quality checks, and maintenance activities will be essential. Collaboration with other engineers, technicians, and production staff will be necessary to ensure seamless operations, and you will also engage with equipment vendors and chemical suppliers to drive continuous improvement projects.
