Boeing-posted about 2 months ago
$85,850 - $171,350/Yr
Full-time • Entry Level
Onsite • El Segundo, CA
Transportation Equipment Manufacturing

Boeing Space, Intelligence & Weapons Systems is currently hiring a Space Electronics Packaging and Mechanical Product Design and Analysis Engineer (Associate, Mid-Level or Senior) to join us as part of our Electronics Packaging and Product Design Team located in El Segundo, CA. The ideal candidate will be highly proficient in top ‑ down assembly modeling, skeleton modeling and intent capture, applying GD&T correctly and comprehensively, and performing DFMAT (Design for Manufacturing, Assembly & Test) to close the loop between design and production. This role will drive complex assemblies from concept through production release, mentor junior designers, and collaborate cross ‑ functionally with manufacturing, tooling, electrical and quality teams. We offer an unparalleled opportunity to be part of a team that conducts full in-house cradle-to-grave work, providing you with a unique and fulfilling experience. From the moment you step through our doors, you will have the chance to contribute to every stage of the product lifecycle, from initial design concepts to prototyping and final production. This includes mechanical PCB design, Electronics Packaging, and Thermal/Structural/Vibration Analysis. You will be at the forefront of satellite missions, unlocking new frontiers in space exploration. In addition, you will have the opportunity to work on projects involving multichip modules, microelectronics, electronic systems, and much more. The breadth of our work while working alongside world-class engineers and mentors, will inspire and guide you and challenge you to expand your skillset and delve into fascinating new areas, making every day a thrilling adventure. To further enhance your experience, our on-site satellite factory is at your disposal, enabling you to unleash your creativity and expertise while delivering solutions at the highest level of excellence. This proximity allows for seamless collaboration with satellite engineers, giving you firsthand knowledge of the intricacies and complexities of satellite missions. By working closely with experts in the field, you will contribute to the seamless integration of our electronics packaging solutions, ensuring they meet the rigorous demands of the space environment. Develop your technical competence as well as your leadership skills at a company with huge potential for long-term career growth. We're highly supportive of innovative thinking, we respect and acknowledge hard work, we recognize maturity and integrity, and we reward bottom-line achievement.

  • Coordinate with multi-discipline groups to develop and understand requirements and develop high-level and detailed designs consistent with those requirements.
  • Guide structural design and configuration development by performing trade studies to optimize structure and meet program requirements.
  • Perform detailed structural and thermal analysis using hand calculations and analysis tools.
  • Document structural analyses and data, required to show compliance with Boeing, customer and regulatory requirements, at a module, slice, and unit level.
  • Collaborate with Electrical Engineering team to perform sizing and placement studies, as well as layout and route printed circuit boards (PCBs).
  • Validate designs through various methods of review, testing and analysis.
  • Develop, deploy and support new processes and process improvement to enable efficient performance of engineering tasks to reduce cycle time and drive product improvements.
  • Conduct Root Cause and Corrective Action to investigate failures and go-forward plans.
  • Identify, track and status technical performance measures to measure progress and ensure compliance with requirements.
  • Support Supplier Management with make/buy recommendations and other technical services of limited scope.
  • Investigate emerging technologies to develop concepts for future product designs to meet projected requirements.
  • Work under general direction.
  • Bachelor of Science degree from an accredited course of study in engineering, engineering technology (includes manufacturing engineering technology), chemistry, physics, mathematics, data science, or computer science.
  • Ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship.
  • Experience using Computer-Aided Design (CAD) tools.
  • Experience with DFMAT (Design for Manufacturing, Assembly & Test).
  • Experience with thermal, structural, dynamics, and/or vibration analysis and tools -OR- experience with Printed Circuit Boards (PCB) design or assembly.
  • 3+ years of related work experience or an equivalent combination of education and experience.
  • 5+ years of related work experience or an equivalent combination of education and experience.
  • Experience with electronic packaging design and/or analysis.
  • Experience within aerospace or related industry or with space electronics.
  • Experience with ANSYS analysis, Creo CAD, SolidWorks, Finite Element Analysis (FEA), Siemens NX Nastran, MSC Patran, COMSOL Multiphysics.
  • Excellent oral and written communication skills and ability to communicate across multiple disciplines with internal and external customers.
  • Skill and ability to collect, organize, synthesize, and analyze data; summarize findings; develop conclusions and recommendations from appropriate data sources.
  • Experience leading teams on complex projects.
  • Competitive base pay and variable compensation opportunities.
  • Health insurance.
  • Flexible spending accounts.
  • Health savings accounts.
  • Retirement savings plans.
  • Life and disability insurance programs.
  • Programs that provide for both paid and unpaid time away from work.
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