Module Software Solutions Group within Assembly Test Technology Development (ATTD) is seeking a Software Engineering Intern to work on the next generation of Intel's test equipment software. Job assignments are usually for the summer or for short periods during breaks from school. Responsibilities may be quite diverse of a technical nature: Feature definition, development and maintenance of Intel's High-Volume Manufacturing (HVM) test equipment software. Participate in all phases of the software development life cycle. Cross-geo collaboration with engineering teams across Intel. Participation as well as driving design and code reviews. Finding opportunities to improve quality of the product and testing processes, bug fixes etc. Candidate should also exhibit the following behavioral traits: Effectively communicate and capable to interface with team members and customers. Collaborate and align with team members internal/external stakeholders and partnership skills. Demonstrate data analytics skills to communicate complex data in a simple process issues and identification of a solution. Program management, leadership skills or project planning experience. Responsibilities may be quite diverse of a nonexempt technical nature.U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school. This is an internship and compensation will be given accordingly based on candidate education level and internship duration.
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Career Level
Intern
Number of Employees
5,001-10,000 employees