KLA-posted 7 days ago
$21 - $29/Yr
Intern
Ann Arbor, MI
5,001-10,000 employees

KLA is seeking motivated interns to contribute to exciting projects at our Ann Arbor, Michigan location in the summer of 2026 You’ll dive into the world of semiconductor manufacturing equipment, you’ll collaborate with fellow interns and experienced engineers on a focused aspect of a larger initiative, gaining real-world experience in a dynamic, team-oriented environment. This is a unique opportunity to apply your technical skills to meaningful, impactful work, learn from experts in the field, and be part of a fast-paced, innovative culture. As an intern, you will: Learn about the data being produced by tools in the semiconductor fab Leverage AI technologies to automate tool anomaly detection Develop data driven, intelligent models to transform the way tools are serviced

  • Learn about the data being produced by tools in the semiconductor fab
  • Leverage AI technologies to automate tool anomaly detection
  • Develop data driven, intelligent models to transform the way tools are serviced
  • completed fundamental coursework in Computer Science
  • basic skills in Python, machine learning, and AI
  • Strong analytical and problem-solving skills
  • Excellent written and verbal communication
  • Effective interpersonal skills and a collaborative mindset
  • A proactive attitude and the perseverance to tackle complex challenges
  • The ability to work seamlessly with cross-functional teams across various locations
  • Some College or work experience of 0 years
  • Familiarity with other relevant areas is a plus.
  • medical, dental, vision, life, and other voluntary benefits
  • 401(K) including company matching
  • employee stock purchase program (ESPP)
  • student debt assistance
  • tuition reimbursement program
  • development and career growth opportunities and programs
  • financial planning benefits
  • wellness benefits including an employee assistance program (EAP)
  • paid time off and paid company holidays
  • family care and bonding leave
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