Tenstorrent-posted about 1 month ago
$100,000 - $500,000/Yr
Full-time • Mid Level
Hybrid • Austin, TX
501-1,000 employees
Professional, Scientific, and Technical Services

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a SoC Physical Design Verification Engineer to drive full-chip signoff and ensure manufacturable, high-quality silicon across advanced technology nodes. You'll lead physical verification closure (DRC, LVS, ERC, etc.), debug issues using standard industry PV tools, and collaborate across RTL, PD, CAD, and packaging teams to achieve successful tapeouts. If you thrive in a fast-paced environment and enjoy solving complex challenges in cutting-edge silicon, we'd love to hear from you. This role is hybrid, based out of Santa Clara, CA; Austin, TX; or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting.

  • BS or MS in Engineering (Electrical, Electronics, or related field).
  • 7-14 years of hands-on experience in CPU/IP/SoC physical verification.
  • Strong command of industry-standard tools and flows (Calibre, ICV, Pegasus, FC, Innovus, etc.).
  • Proven expertise in DRC, LVS, ERC, PERC, Antenna, and DFM verification.
  • Solid understanding of advanced node challenges (7nm, 5nm, 3nm) and FinFET design considerations.
  • Scripting proficiency (Python, TCL) for automation and flow optimization.
  • Familiarity with ESD planning, padring integration, bump/RDL strategies, and reliability analysis (IR drop, EM).
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