SoC Physical Design Verification Engineer

Apple • Beaverton, OR

122d

About The Position

At Apple, we work every single day to craft products that enrich people's lives! Do you love creating elegant solutions to highly complex challenges? Do you intrinsically see the importance in every detail? As part of our Silicon Technologies group, you'll help design and manufacture our next-generation, high-performance, power-efficient processor, system-on-chip (SoC). You'll ensure Apple products and services can seamlessly and efficiently handle the tasks that make them beloved by millions. Joining our group means you'll be responsible for crafting and building the technology that fuels Apple's devices. Together, we will enable our customers to do all the things they love with their devices! In this highly visible role, you will be part of a critical team responsible for physical verification of an SOC.

Requirements

• Minimum BS and 3+ years of relevant industry experience.
• Experience with physical verification flows: DRC/LVS/ANT/HVDRC signoff flows and/or full-chip integration methodology.
• Experience with ESD, macro placement design guidelines, digital/analog mixed signal back-end verification checks and/or methodology.

Nice To Haves

• Knowledge of all aspects of ASIC physical design and physical verification checks.
• Scripting skills in perl/python/tcl to debug flow related issues and automate checks.
• Experience with industry standard tools used for physical verification: Mentor Calibre, and/or Synopsys ICV.
• Tapeout experience with a track record of successful signoff.
• Layout design experience.

Responsibilities

• Perform various types of physical verification checks (such as LVS, DRC, design-for-manufacturing & design-for-yield, and lithography) at the chip and block level.
• Collaborate with the CAD/Technology teams for flow bring up and validation.
• Work directly with the implementation team during the entire chip design cycle to drive signoff closure for tapeout.
• Lead schedules and support cross-functional engineering efforts.
• Work on padring, bump, RDL design, and collaborate with the package and floorplan teams.

What This Job Offers

• Career Level: Mid Level
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Bachelor's degree