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Apple's Biophotonics team is seeking a seasoned process integration engineer to join their rapidly expanding silicon photonics group. This individual will be responsible for the exploration and development of advanced packaging processes, including but not limited to 2.5D and/or 3D integration of photonic integrated circuits. Additionally, this role is expected to drive subassembly-level reliability assessments of the prototypes developed by the team. As a key member of a multidisciplinary team working on the next generation of silicon photonics integrated circuits, this position will operate in a dynamic environment that demands a strong understanding of design specifications, deep knowledge of process capabilities and limitations, thorough data analysis, and exceptional communication skills.
