Silicon Photonics Packaging Module Integration Engineer Intern (2026 Spring)

GlobalFoundries

1d • $20 - $40

About The Position

GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com. Internship Program Overview: Our Interns & Co-ops are our entry-level talent pipeline for GF across the globe. Our goal is to provide students with a meaningful work experience that will equip them with the skills to embark on a career in the fast-paced and growing semiconductor industry after graduation. As an intern at GF, you’ll experience one-on-one mentorship, work assignments that prioritize your growth and potential, professional development opportunities, and the chance to network with executives. Summary of Role: As a Packaging & Photonics Integration Intern, you will support the development of advanced electro‑optical transceivers using GF’s Photonix platform. You’ll gain hands‑on experience with silicon photonics (SiPh) flip‑chip assembly, advanced 2.5D/3D packaging, and optical/electrical interconnect technologies. This role supports reliability testing, materials evaluation, design rule development, and process integration for next‑generation photonic modules.

Requirements

• Education – At least a sophomore at time of application and actively pursuing a Bachelor’s in Engineering or related field through an accredited degree program during the time of internship. Must have at least an overall 3.0 GPA and be in good academic standing.
• Language Fluency - English (Written & Verbal)
• Ability to work at least 20 hours per week during the internship.

Nice To Haves

• Prior related internship or co-op experience
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e., the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills
• Strong planning & organizational skills

Responsibilities

• Assist in defining and improving assembly process flows for co‑packaged optical modules.
• Help develop manufacturing‑driven design rules and reliability test plans.
• Support packaging design reviews, materials assessments, and risk/FMEA activities.
• Collaborate with cross‑functional teams to troubleshoot technical and yield issues.
• Contribute to test structure development for process characterization.
• Participate in data analysis, project tracking, and continuous improvement initiatives.
• Work with engineers on optical fiber attach methods (e.g., grating couplers, edge couplers, V‑grooves).
• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.

What This Job Offers

• Career Level: Intern