Intel-posted 7 months ago
$139,710 - $197,230/Yr
Full-time • Mid Level
Hybrid • Folsom, CA
Computer and Electronic Product Manufacturing

Are you passionate about ensuring high-quality power and signal integrity solution in cutting-edge heterogeneous SoCs for high-power discrete graphics products? Disrupting the industry with your innovation? Working with leading graphics hardware engineers on Intel's latest GPU/CPU architecture? Do you love collaborating with diverse teams to help achieve best-in-class visual experiences that enable users to immerse themselves in a new visual future? Then Intel's Power and Signal Integrity Group within Graphics Organization has opportunities for you. If you join the team, you will develop hardware and graphics solutions for Intel products including the newest IPs targeted at next gen GPUs. You will have the opportunity to participate as a signal integrity engineer in enabling technologies in the areas of high-power processors with high-speed IO interfaces and design solutions. We are a winning team with a clear vision of delivering competitive and cutting-edge products, and we care about building the best products and the best skills for our team. Intel Corporation's state of the art facilities gives you the opportunity to learn a variety of technical and operational skills to develop, operate, maintain, and repair the world's most advanced facility equipment, in a demanding and challenging operations environment.

  • Delivers signal integrity solutions for large, complex high speed platforms, boards, and packages.
  • Develops a viable space for all interconnects including 2D and 3D models extracts of electrical structures for the entire die to die interconnect.
  • Defines signal integrity rules, reviews implementation, documents characterization and measurement reports, and improves and optimizes design margins.
  • Applies knowledge of signal integrity design and tradeoffs to perform simulations of interconnect and guide package and platform physical implementation.
  • Designs and characterizes test structures to correlate simulations and measurements for interconnects using intricate highspeed equipment and debugs challenges.
  • Develops electrical specifications and new industry standard interconnect specifications to guide consortiums for next generation interfaces.
  • Documents and provides implementation guidelines to the end customers as part of the platform design guide.
  • Collaborates with IP design teams and silicon integration teams to ensure the IP and SoC designs maximize the platform level solution space to meet targeted product landing zone requirements and minimize quality degradation.
  • Bachelor's Degree in Electrical Engineering or Computer Engineering with 3+ years of experience in Signal Integrity OR a Masters Degree in Electrical Engineering or Computer Engineering with 2+ years of experience in Signal Integrity.
  • Knowledge of Silicon, Package and PCB layouts and SI design practices.
  • Good understanding of transmission line and network theory, microwave engineering.
  • Expertise in circuit simulation with Spice, ADS and EM extractions with commercially available solvers from Ansys HFSS, Q3D, Cadence PowerSI, Synopsys HSpice and Keysight ADS.
  • Familiarity with DDR and SERDES interfaces, such as LPDDR5/5x/6, GDDR6/7, PCIe Gen5/6, HDMI, eDP, I3C, SVID, etc.
  • Basic understanding of EMI/RFI theory and analysis.
  • Experienced in full channel analysis in frequency and time domain for DDR and SERDES interfaces.
  • Competitive pay
  • Stock options
  • Bonuses
  • Health benefits
  • Retirement plans
  • Vacation
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