Shift 5 Module Engineer On Shift (MEOS)

Intel • Chandler, AZ

14d • Onsite

About The Position

Become a part of Intel's Advanced Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTD:S&WA) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the APTD:S&WA organization to assist in achieving our mission and continuing to make this a great place to work. The role of a Module Engineer On Shift (MEOS) is to provide factory support by handling equipment, process and product issues in real-time to facilitate 24x7 lot movement through the manufacturing line. MEOS responds to process issues, error recovery, lot disposition, new tool enabling and many ad-hoc duties in specific functional area that the factory may require.Your role and responsibilities include (but are not limited to): Receiving both written and verbal pass down from leaving shift peers. Aligning on priorities with management. Majority of shift is in the factory supporting tool and process issues; Writing/Updating Specs and RFCs as needed. Executing non-standard procedures and performs Inspection and imaging on panels to get development data. Communicate by email with Tool/Lot Owners for key issues. Provide a quality pass down of all shift activities to on-coming shift both written and verbal. Aside from the qualifications provided below, the ideal candidate shall possess the following behavioral traits: Problem-solving and troubleshooting skills. Verbal and written communication skills with the skills to effectively communicate with peers, engineers and customers. Flexibility and efficiency of handling new tasks. Skills to work with minimal supervision and adjust to rapidly changing priorities. Be a self-starter capable of managing own activities as well as supporting team activities.

Requirements

• You must possess the below minimum qualifications to be initially considered for this position.
• Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
• Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.
• This position is not eligible for Intel immigration sponsorship.
• Minimum requirements: Bachelor's degree in any of these engineering disciplines: Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline with 1+ years of relevant experience.
• -OR- Master's degree in any of these engineering disciplines Materials Engineering, Mechanical Engineering, Chemical Engineering, Chemistry, Physics, or related discipline.

Nice To Haves

• 1+ years of experience in statistical process control (SPC), Metrology tool recipe creation and tool troubleshooting.
• 1+ years of experience in Semiconductor Packaging or Packaging substrate manufacturing.

Responsibilities

• Receiving both written and verbal pass down from leaving shift peers.
• Aligning on priorities with management.
• Majority of shift is in the factory supporting tool and process issues
• Writing/Updating Specs and RFCs as needed.
• Executing non-standard procedures and performs Inspection and imaging on panels to get development data.
• Communicate by email with Tool/Lot Owners for key issues.
• Provide a quality pass down of all shift activities to on-coming shift both written and verbal.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
• Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees