Become a part of Intel's Advanced Packaging Team by joining the Advanced Packaging Technology Development: Substrate and Wafer Assembly (APTD:S&WA) organization. Our mission is to be the supplier of choice for leading and affordable substrate packaging. Join the APTD:S&WA organization to assist in achieving our mission and continuing to make this a great place to work. The role of a Module Engineer On Shift (MEOS) is to provide factory support by handling equipment, process and product issues in real-time to facilitate 24x7 lot movement through the manufacturing line. MEOS responds to process issues, error recovery, lot disposition, new tool enabling and many ad-hoc duties in specific functional area that the factory may require.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees