About The Position

Qualcomm Data Center team is developing High performance, Energy efficient server solution for data center applications. We are looking for highly talented, innovative, teamwork-oriented individuals for our cutting-edge technology work! Our Mission We are dedicated to transforming the industry by reimagining silicon and developing next-generation computing platforms. By joining our team, you’ll collaborate with world-class engineers to create innovative solutions that push the limits of performance, energy efficiency, and scalability. Our focus is on developing reference platforms based on Qualcomm's Snapdragon SoC, delivering a comprehensive solution that includes hardware, software, reference designs, user guides, SDKs, and more. Position: Server FEA Engineer We are seeking a Staff / Senior Staff Server FEA Engineer to serve as a technical authority for structural simulation and system-level modeling of high-performance server platforms. This role owns multi-scale structural physics spanning package, board, server chassis assembly, and full system/rack-level architectures. As a senior individual contributor, you will lead system-level structural integrity, dynamics, and reliability modeling, ensuring mechanical robustness, manufacturability, and lifecycle reliability of servers from package through in-rack deployment. You will partner closely with packaging, electrical, thermal, mechanical, manufacturing, reliability, systems, and supplier teams to drive simulation-informed platform design.

Requirements

  • Master’s degree in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
  • Strong background in structural mechanics, materials science, and structural dynamics
  • 6+ years of advanced FEA experience in high-tech hardware platforms spanning microelectronics packaging, BGAs/sockets, board-level systems, server chassis assemblies, and full system-level structures
  • Proficiency in ANSYS, ABAQUS, HyperMesh, or equivalent
  • Experience correlating system-level FEA with physical testing (modal, shock, vibration, environmental)
  • Strong technical documentation and communication skills
  • Proven ability to operate independently and lead within cross-functional teams
  • Bachelor's degree in Engineering, Information Systems, Computer Science, or related field and 6+ years of Systems Engineering or related work experience.
  • Master's degree in Engineering, Information Systems, Computer Science, or related field and 5+ years of Systems Engineering or related work experience.
  • PhD in Engineering, Information Systems, Computer Science, or related field and 4+ years of Systems Engineering or related work experience.

Nice To Haves

  • Ph.D. in Mechanical Engineering, Engineering Mechanics, Materials Science, Physics, or related field
  • 10+ years of advanced FEA experience
  • Expertise in structural and system-level FEA
  • Experience with rack-scale modeling and in-rack boundary condition simulation
  • Deep experience in holistic structural analysis spanning die, package, board, chassis, and rack-integrated systems
  • Experience with multi-physics coupling (structural–thermal–mechanical)
  • Platform-level simulation ownership across multiple server generations
  • Understanding of OCP product designs and industry best practice

Responsibilities

  • Lead multi-scale FEA across package, board, chassis assembly, system, and rack levels
  • Own system-level structural simulation, including server chassis assemblies, multi-node integration, and in-rack boundary conditions
  • Lead structural dynamics modeling (modal, shock, drop, random vibration, harmonic response, coupled system dynamics)
  • Drive platform-level structural architecture through simulation-based decisions
  • Correlate analytical models with component-, system-, and rack-level test data
  • Define and maintain platform simulation methodologies, modeling standards, and validation frameworks
  • Translate simulation into clear design guidance for cross-functional teams
  • Present technical analyses to engineering leadership, customers, and suppliers
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