Senior Systems Engineer – TCU Systems

Boyd • Phoenix, AZ

4d • Onsite

About The Position

Position Summary The Senior System Engineer leads the design, integration, and optimization of advanced electro-mechanical systems used in semiconductor testing—particularly TCU systems and their related peripherals. This role provides technical leadership across mechanical, electrical, controls, and software teams to ensure high precision, reliability, and throughput for R&D, production and engineering test environments. The candidate will take high-level customer requirements and translate them into workable solutions using our TCU technology, while leading the group towards continuous improvement.

Requirements

• Bachelor’s in mechanical engineering, electrical engineering, systems engineering or other engineering related field.
• 10+ years of experience in electro-mechanical system design, integration, or testing—preferably with semiconductor ATE or handler systems.
• Expertise with precision mechanics, motion control, robotics, sensors, thermal systems, and embedded control integration.
• Proficiency with CAD/electrical schematics and system-level troubleshooting.
• Strong understanding of alignment, metrology, vibration control, and contamination considerations.
• Familiarity with FEA/CFD, Solidworks, and automation/test tools.
• Strong analytical and system-level problem-solving capability.
• Excellent communication and cross-functional leadership.
• Ability to manage technical risks and drive complex projects.
• Clear documentation and decision-making skills.
• Ability to interface with customers at an advanced level, using prior experience to address current requirements as well as future challenges.

Nice To Haves

• Masters’s in Engineering Management or Business Administration.
• Expert level experience with TCU systems and handler integrated equipment.
• 15+ years of experience in electro-mechanical system design, integration, or testing—preferably with semiconductor ATE or handler systems.
• Expertise in various IC packages (i.e. QFN, BGA, QFP, CSP, etc.) and methods for accommodating testing techniques of each class.
• Advanced design with TCU socket/package adapter technology, methods, limitations, etc.
• Experience with wafer probe stations, handlers, automated test equipment, or similar capital equipment.
• Certifications: Six Sigma, Lean and/or industry-specific training.
• Strong familiarity with the IC industry, history, trends

Responsibilities

• Lead system architecture, requirements definition, and integration planning for TCU systems and related peripheral equipment.
• Oversee integration of thermal subsystems, control electronics, and embedded controllers.
• Drive system-level validation, calibration, and performance characterization (accuracy, repeatability, thermal stability, signal integrity).
• Diagnose complex issues involving mechanical precision, electrical noise, automation logic, or reliability; lead root-cause analysis and corrective actions.
• Collaborate with software, controls, mechanical, and electrical teams to implement motion control, automation workflows, and system logic.
• Ensure compliance with Boyd and customer standards, safety regulations, and industry best practices.
• Support DFM/DFA, pilot builds, manufacturing transfer, and field escalations for production systems.
• Mentor junior engineers and provide technical guidance during design reviews and cross-functional decisions.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees