Senior Substrate Layout Design engineer

ZP Group•Saratoga, CA

31d•$150,000 - $180,000•Onsite

About The Position

Piper Companies is seeking a Senior Substrate Layout Designer who will be responsible for leading the design of advanced multi-die substrate packages. The layout designer will be onsite 5 days a week in Saratoga, CA.

Requirements

6 - 8+ years of experience in substrate layout design for high-performance IC packaging
Proven experience expertise in organic substrate design from silicon to BGA
Deep understanding of chiplet-based, multi-die, and advanced packaging (FPGA, CPU, CPU, MCM, CoWoS)
Strong collaboration skills with ASIC, signal, and power teams
Proficiency in Cadence Allegro APD and AutoCAD
Experience working with OSATs and substrate supplies
Bachelor's degree in Electrical Engineering or equivalent experience.

Responsibilities

Lead the end-to-end physical layout of high-density, multi-die substrate design.
Design and optimize bump maps, breakout routing, via structures, and layer stack-ups.
Collaborate with ASIC, signal integrity, and power teams to ensure clean escape routing and breakout strategies
Evaluate routing feasibility in co-design environments, considering die floorplans and mechanical constraints.
Drive DRC, DFM, and manufacturing rule checks to ensure fabrication readiness
Interface with substrate vendors and OSATs for tape-out and manufacturability validation.
Conduct technical reviews and iterate on layout improvements with internal and external stakeholders