Senior Staff Signal & Power Integrity Engineer

MaxLinear, Inc.Carlsbad, CA
73d$114,504 - $177,725

About The Position

MaxLinear is seeking a Principal Signal & Power Integrity Engineer (SI/PI Engineer) to join our team. In this role, you will focus on the development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products. You will perform SI/PI simulations and optimization to ensure critical signals meet their required specifications. The position involves designing and simulating high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs. You will work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 800G/1.6Tbps DSPs and TIAs) for data center connectivity and storage for AI applications.

Requirements

  • Deep understanding of Electromagnetic fundamentals, transmission lines, and microwave theory
  • Experience designing and simulating signal and power integrity solutions for high-speed system components (packages, PCB, connectors)
  • Experience with high-speed channel simulations for SerDes and transient simulations for SI and PI
  • Understanding of S-parameters, Smith Chart, and frequency domain analysis
  • Proficiency in use of 2.5D and 3D simulation tools such as ANSYS HFSS, SIwave, Cadence Sigrity tools, or similar field solvers
  • Expertise in time and frequency domain analysis using simulation tools like ADS and SPECTRE
  • Hands-on experience with lab measurement equipment like Spectrum Analyzer, Vector Network Analyzer (VNA), Oscilloscopes, TDR
  • Ability to manage package development in collaboration with cross functional teams including systems, IC design, IC physical layout, package/PCB layout, and test/characterization teams
  • Self-motivated with ability to work effectively in both independent and team settings
  • Strong communication, presentation, and documentation skills
  • Excellent problem-solving skills; Ability to excel in a fast-paced environment

Nice To Haves

  • Experience with layout tools such as Cadence Allegro and APD
  • Understanding of different IEEE and Optical standards to define design guidelines
  • Experience with electro-optic integration on packages; co-packaging of DC-DC convertors, regulator, TIAs, and optical drivers. Multi-chip package design
  • Familiarity with IC design flows, floor-planning, IO ring design, on-chip decoupling, on-die EM/IR analysis
  • BS in Electrical Engineering or related + 7 years of experience, or MS + 5 years of experience, or Ph.D. + 2 years of experience

Responsibilities

  • Development of state-of-the-art packages and printed circuit boards (PCBs) for MaxLinear’s next generation products
  • Perform SI/PI simulations and optimization to ensure critical signals meet their required specifications
  • Design and simulate high-speed signal interfaces and power distribution networks (PDN) for advanced communications SoC packages and PCBs
  • Work on a diverse set of products and applications including RF/mm-wave modems and transceivers, 5G communication, wireless connectivity, and optical communications (PAM4 800G/1.6Tbps DSPs and TIAs) for data center connectivity and storage for AI applications

Benefits

  • Health care benefits
  • 401k savings plan
  • Employee Stock Purchase Plan (ESPP)
  • Paid time off

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What This Job Offers

Job Type

Full-time

Career Level

Senior

Education Level

Master's degree

Number of Employees

1,001-5,000 employees

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