Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. The Process Quality Engineering (PQE) team operates at the intersection of Technology Development (TD) and High-Volume Manufacturing (HVM – ID1) in Boise, ID. PQE leads HVM FOUP Environment Control (FEC) programs, partnering with multiple engineering teams and Process Integration to understand processes, tools, systems, and challenges. The team prioritizes, defines, and drives studies on the impact of Airborne Molecular Contamination (AMC) within FOUP environments on wafer yield, and implements effective AMC countermeasures. As a Process Quality Engineer, you will be recognized as a domain expert in FOUP Environment Control (FEC) for yield improvement. You will collaborate with collaborators across our Boise fabs and Micron’s global fab network to drive enhancements in process quality and wafer yield.