Senior Silicon Photonics TD Quality and Reliability Engineer

Intel Corporation • Hillsboro, OR

3d • Onsite

About The Position

Join Intel’s Silicon Photonics Q&R (SiPh) team that is in transformation and in its growing phase now, working to enable our internal leading edge SiPh photonics technology with integrated hybrid lasers and SOAs to our Intel Foundry customers. This is a unique opportunity to be part of the team that have propelled Intel to become a widely recognized leader in high-volume silicon photonics manufacturing and reliability! As a Senior Silicon Photonics (SiPh) Technology Development Quality and Reliability Engineer (Sr. SiPh TD QRE), you will be part of the Photonic TD team. Working both on path-finding photonic technologies and devices for the future and on current nodes of our photic processes. Your new team, (SiPh TD QnR), is at the forefront of silicon photonics technology development, working closely and collaborating with the SiPh fab process integration, Integrated Photonics Solutions (IPS) R&D design team, Foundry Q&R teams and other organizations to ensure reliability for internal and external SiPh device technologies, process certification, and product qualifications. Responsibilities may include but not be limited to: Assess intrinsic and extrinsic reliability of photonic devices and photonic ICs post fabrication and in integrated products form-factors. Work on process changes to optimize reliability. Conduct DOEs to develop reliability models of the devices. Develop new reliability characterization and acceleration techniques, analytical tools, and quality screens as required. Determine requirements for both process certification and product qualification purposes. Collaborate cross-functional teams to drive the quality and reliability aspects of the SiPh technology development following Intel’s Development Life Cycle methodology. Determine root causes/mechanisms of failures when encountered from reliability testing activities or customer returns as needed. Review white papers and provide appropriate actions related to quality and reliability area. Ensure smooth transition from development phase to HVM phase with proper quality systems, engineering shipment management, fab excursion support, and process change support. The ideal candidate should exhibit the following behavioral traits: Excellent communication skills (both verbal and written). Strong networking, teamwork, and social skills. Ability to work in a diverse and multi-cultural team environment. Work under pressure, and in an ever-changing and dynamic environment. Push forward multiple parallel efforts (multi-tasking) in a constrained environment. Strong problem-solving skills. Curious, eager, proactive, and quick to learn. An independent thinker who can drive and develop solutions and implement them. In addition to the qualifications described below, a successful candidate will demonstrate: Usage of failure mode effects analyses and model-based problem-solving approaches. Knowledge of statistics and data analysis, including the advanced use of tools such as Excel, SAS and JMP. Specifically on advanced statistics and large data sets analysis tools and applications. Skills to deliver concise key messages for senior management review. Influencing cross-functional teams to achieve extraordinary results. Strong execution experience and commitment. Passionate about quality and reliability as it relates to developing new technologies.

Requirements

• 2+ years of proven experience in Photonics devices development at a leading foundry OR 4+ year photonics experience from an academic institution.
• OR 4+ year hands-on compound semiconductor processing experience with deep knowledge of Photonic device physics.
• OR 4+ years of relevant engineering experience in Photonics with device characterization, yield, reliability, or test/validation experience.
• PhD graduates with outstanding work in Photonics are encouraged to apply!
• OR- MSc in Engineering or related field and with 4+ year experience in Photonic devices

Nice To Haves

• PhD in Materials Science, Chemistry, Chemical Engineering, Physics, photonic devices, or related fields.
• 4+ years’ experience in process certification/product qualification and reliability risk assessment, quality systems, and quality culture knowledge.
• Semiconductor device physics and defect mechanism knowledge.
• Knowledge of semiconductor manufacturing processes, manufacturing process development, material characterization and development, and design validation.
• Hands-on semiconductor wafer fabrication process and process integration challenges.
• Reliability failure statistics, physics, failure mechanisms, and failure analysis methodologies.
• Experience in of SPC/DOE principles, DOEs execution, and statistical analysis.
• Data extraction and analysis skills (JMP/Crystal Ball/ILM/REL/PCS/SQL Scripting).
• Experienced in model-based problem solving and familiar with other industry standard problem-solving techniques (5 why's, 8D).
• Knowledge of photonic datacom and telecom reliability qualification standards such as Telcordia GR-468, AEC-Q102.

Responsibilities

• Assess intrinsic and extrinsic reliability of photonic devices and photonic ICs post fabrication and in integrated products form-factors.
• Work on process changes to optimize reliability.
• Conduct DOEs to develop reliability models of the devices.
• Develop new reliability characterization and acceleration techniques, analytical tools, and quality screens as required.
• Determine requirements for both process certification and product qualification purposes.
• Collaborate cross-functional teams to drive the quality and reliability aspects of the SiPh technology development following Intel’s Development Life Cycle methodology.
• Determine root causes/mechanisms of failures when encountered from reliability testing activities or customer returns as needed.
• Review white papers and provide appropriate actions related to quality and reliability area.
• Ensure smooth transition from development phase to HVM phase with proper quality systems, engineering shipment management, fab excursion support, and process change support.

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Ph.D. or professional degree