Senior Process Engineer, Backgrind

Coherent • Sherman, TX

123d

About The Position

The position involves process development and optimization, focusing on backgrind, bond, debond, and amine clean processes to meet performance and yield targets. The role requires establishing process parameters for GaAs and InP substrates, monitoring equipment performance, and implementing corrective actions as needed. Collaboration with integration engineering is essential to transfer new processes into production. Additionally, the role includes developing and maintaining in-line and offline metrology techniques to characterize all processes, monitoring SPC, and driving corrective actions to minimize variation. The candidate will serve as the technical expert for standard backgrind, bond, and debond processing, leading troubleshooting efforts for process deviations and issues, and partnering with equipment vendors and internal maintenance teams to improve tool performance and uptime. The position also involves conducting failure analysis and defect characterization to identify root causes of process variation, implementing process improvements to enhance yield and reduce defectivity, and leading continuous improvement initiatives to enhance productivity and process robustness. Documentation and training responsibilities include developing and maintaining process documentation, training process technicians and junior engineers on best practices and troubleshooting techniques.

Requirements

• 5+ years experience in semiconductor process engineering with focus on backgrind, bond and debond.
• Experience with GaAs and InP substrates preferred.
• BS/MS degree in Materials Science, Electrical Engineering, Chemical Engineering, Physics or related field.
• Hands-on experience with standard backgrind, bond and debond to sapphires, amine clean.
• Strong background in data analysis and SPC, proficiency with JMP preferred.
• Fluency in MS Office suite.
• Strong problem solving and root cause analysis skills.
• Excellent written and verbal communication skills.
• Strong interpersonal, teaming, and presentation skills.
• Experience with process integration in a high volume manufacturing environment.

Responsibilities

• Develop and optimize backgrind, bond, debond, and amine clean processes to meet performance and yield targets.
• Establish process parameters for GaAs and InP substrates, monitor equipment performance, and implement corrective actions as needed.
• Collaborate with integration engineering to transfer new processes into production.
• Develop and maintain in-line and offline metrology techniques to characterize all processes.
• Monitor SPC and drive corrective actions to minimize variation.
• Serve as the technical expert for standard backgrind, bond, and debond processing.
• Lead troubleshooting efforts for process deviations and issues.
• Partner with equipment vendors and internal maintenance teams to improve tool performance and uptime.
• Conduct failure analysis and defect characterization to identify root causes of process variation.
• Implement process improvements to enhance yield and reduce defectivity.
• Lead continuous improvement initiatives to enhance productivity and process robustness.
• Develop and maintain process documentation, including work instructions, FMEA, and control plans.
• Train process technicians and junior engineers on best practices and troubleshooting techniques.

Benefits

• Equal opportunity/affirmative action employer.
• Consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law.

What This Job Offers

• Industry: Computer and Electronic Product Manufacturing
• Education Level: Bachelor's degree