Senior Principal RF Module Design Engineer

Qorvo • Richardson, TX

4d

About The Position

Our systems, technology and research (ST&R) advanced development organization is looking for innovative and experienced Senior Principal RF Microwave Multi-chip Module Design Engineers. This individual will be responsible for the development of advanced high frequency RF/Microwave components utilizing the newest technologies. The position will involve research, architecture, design, and development of highly complex multi-chip modules that would integrate Antennas, III-V MMICs, and Silicon based ICs (BFICs, RFICs, PMICs) into advanced state-of-the-art 3DHI packaging technologies. You will be a leading member of a research team that is chartered to develop the most complex and challenging prototypes and demonstrators for Qorvo’s aerospace and defense applications.

Requirements

• Experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, BFICs, PMICs, etc. in multichip modules
• Expert-level user in 3D EM simulation tools such as HFSS, Sonnet, FEKO, and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
• Expert in analyzing performance tradeoffs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
• Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
• Hands-on experience in microwave measurements, characterization, and calibration methods.
• Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon for W-band and D-band frequencies
• Knowledge of the thermal and integration challenges of high-power front ends (>1W)
• Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
• Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.
• MS Electrical Engineering with 8 or more years of experience
• PhD Electrical Engineering (with RF/Microwave focus) with 4 or more years of experience

Nice To Haves

• Knowledge of RF signal chain and system analysis is a plus.
• Knowledge of antenna design is a plus.
• Published author in technical journals and/or magazines.
• Strong ability to meet customer technical needs and schedules.

Responsibilities

• Technical lead role for RF/mmWave multi-chip module (MCM) based research
• Integrate MMIC(s) into complex 3DHI module package solutions
• Advanced package design using 2.5D and 3D electromagnetic simulators.
• Laminate design and fabrication
• MCM assembly and design verification testing (DVT) in the test lab.
• Execute DVT analysis and present results to the internal and/or external customer.
• Perform concept feasibility, architecture, and cascade analysis
• Develop innovative solutions and technologies

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees