Senior Principal Reliability Engineer

onsemi • Scottsdale, AZ

8h

About The Position

onsemi is seeking a Senior Principal Reliability Engineer to join our team in Scottsdale, Arizona. In this role, you will serve as a key contributor within a cross‑functional organization dedicated to delivering technologies and products that meet or exceed customer expectations for robustness, durability, and long-term reliability. You will collaborate with a global engineering team to drive the integration of new silicon, silicon carbide, and advanced packaging technologies. This role will champion power cycle methods and analysis within the reliability team, as such the candidate needs strong foundation in power cycle testing methods, effective experimental design along with analysis and communication of results. This position requires deep expertise in power semiconductor device physics, packaging design & materials, and reliability stress testing. The ideal candidate will also demonstrate strong proficiency in lifetime modeling for power semiconductors using statistical tools and reliability data, along with efficient communications with executive stakeholders and external customers.

Requirements

• MS or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, or a related field.
• Knowledge of AQG324 guidelines, power cycle testing and lifetime modeling for power semiconductors.
• Strong understanding of reliability failure mechanisms and physics in semiconductor products.
• Proficiency in structured problem‑solving methodologies and tools (8D, FMEA, fishbone analysis).
• Experience using statistical analysis software (JMP, Minitab).
• Willingness to travel domestically and internationally (less than 10%).
• Excellent verbal and written communication skills in English.

Nice To Haves

• PhD with 4+ years of relevant experience with semiconductor power cycle testing and analysis is a plus.
• 4+ years of experience in reliability engineering or semiconductor fab/package development is a plus.
• Experience in advanced packaging research and development is a plus.
• Thermal characterization experience for power modules is a plus
• Familiarity with industry standards (AQG, AEC, JEDEC, MIL, IEC) is a plus.

Responsibilities

• Drive world class standards for power cycle methods, processes and analysis.
• Perform statistical data analysis to interpret and communicate reliability assessment results.
• Conduct lifetime modeling for power semiconductor products.
• Collaborate with fab and packaging technology development teams to perform reliability assessments and recommend risk‑mitigation strategies.
• Lead structured problem‑solving efforts to identify root causes and define corrective actions for reliability failure mechanisms.
• Develop reliability plans to characterize potential reliability risks and qualify new products, technologies, and process changes.
• Correlate reliability failure mechanisms with design, process, and material characteristics to drive continuous reliability improvement.
• Partner with internal laboratories to execute reliability stress tests and conduct failure analyses.
• Develop and implement new reliability test methodologies in collaboration with internal labs.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Ph.D. or professional degree