Senior Principal Engineer

YK Solutions

1d•$6,000,000 - $9,000,000•Onsite

About The Position

We are seeking a Senior Principal Engineer to lead the firmware development efforts for advanced embedded systems. In this role, you will serve as a technical or project lead, driving a team of 2-8 developers through the complete product development lifecycle. You will be responsible for architecting, designing, developing, and testing embedded C firmware for DSP hardware on RISC-V-based multi-core MCUs, while collaborating across hardware, systems, and cross-functional teams to deliver innovative solutions.

Requirements

Bachelor's or Master's degree in Computer Science Engineering (CSE), Electronics and Communication Engineering (ECE), or related technical field
15+ years of professional experience in memory-constrained embedded C/C++ firmware development
Demonstrated experience as a Software Team Lead or Technical Lead on embedded systems projects
Strong understanding of embedded SoC and microcontroller architecture
Excellent verbal and written communication skills in English
Proficiency with version control systems (Git) and defect tracking tools (Jira)
Hands-on experience with Serdes firmware development
Proven DSP (Digital Signal Processing) knowledge and implementation experience

Nice To Haves

RISC-V architecture knowledge is a significant plus

Responsibilities

Lead product development initiatives as a Technical or Project Lead, managing a team of 2-8 software developers through the entire development lifecycle
Own the architecture, design, development, and testing of embedded C firmware for DSP hardware on RISC-V-based multi-core microcontrollers
Identify and resolve complex debugging issues, driving root cause analysis in collaboration with hardware and systems teams
Partner with cross-functional teams to plan software milestones, define requirements, and coordinate feature rollouts
Translate complex systems specifications into clear, actionable internal documentation and technical requirements
Travel to offices worldwide for product development and chip bring-up activities (approximately 3 weeks per year)