Senior Principal Electronics Process Engineer

Epirus • Torrance, CA

70d

About The Position

This is an exciting role in a growing company. The ideal candidate for the Senior Principal Electronics Process Engineering position is someone who has experience or can lead the implementation of a new PCB manufacturing line, with a specific focus on pallet bonding and surface mount technology (SMT) processes. This role will be instrumental in driving process development, ensuring manufacturing efficiency, and optimizing production workflows to support high-quality PCB assembly. The ideal candidate will have a strong background in PCB manufacturing, SMT, and process engineering, along with experience in equipment selection, validation, and continuous improvement methodologies.

Requirements

• Bachelor's degree in Mechanical, Electrical, Material, Chemical, or other related engineering degree
• 12+ years of experience in manufacturing/mechanical/material engineering role or production environment
• Expertise in pallet bonding techniques, surface mount technology equipment stencil design, solder paste application, reflow soldering, and AOI
• Hands-on experience with SMT equipment, including pick-and-place machines, reflow ovens, wave soldering, and conformal coating
• Strong understanding of Design for Manufacturability and Design for Assembly principles.
• Ability to work extended hours and weekends as needed
• US Citizen (future security clearance may be required)

Nice To Haves

• Aerospace/Defense experience and/or military experience
• Knowledge of geometric dimensioning and tolerances
• Experience with automation, robots, and other factory 4.0 technologies
• Proficient in documenting detailed assembly instructions with 3D models, pictures, diagrams, and text
• Good written and oral communication skills
• Collaborative; capable of working across all levels of the organization
• Knowledge of Production Systems and Lean Manufacturing elements
• Knowledge of Environmental, Health and Safety elements
• Use of SolidWorks, 2D and 3D modeling software
• Experience with RF Products, Electromechanical assembly and test
• Experience with ISO9001/AS9100 quality management systems elements

Responsibilities

• Lead the planning, development, and implementation of pallet bonding equipment, SMT and manual electronics assembly at low/mid volumes, ensuring adherence to quality, efficiency, and industry standards
• Identify and implement lean manufacturing principles, Six Sigma methodologies, and automation solutions to optimize production workflows.
• Monitor and analyze process performance metrics, troubleshoot defects, and implement corrective actions to enhance product yield and quality.
• Partner with engineering team members in the new product introductions (NPI) by developing and iterating on board and box level assembly processes.
• Identify and implement Process Failure Modes and Effects Analysis for PCB related company products
• Provide inputs to manufacturing plans and operation strategy
• Develop trainings and standards for the production technician, and engineering teams to work with implemented equipment

What This Job Offers

• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Bachelor's degree