Senior Principal Electrical Design Engineer
About The Position
Drive Co-Packaged Optics and Optical Engine product design and testing activities from initial concept to production. Develop Silicon Photonic (PIC) and electronics IC (including TIA, driver, and micro-controller) co-design to achieve DC functionalities and high-speed performance. Perform simulations for signal integrity and power integrity analysis, hands-on high speed signal validation and analysis verification including material, de-embedding, and component characterization. Power delivery modeling, simulation, and characterization for die, package, board, and voltage regulators. PCB stack-up review and layer assignment for High speed and PDN Manage PIC and EIC interconnect schematic and monitor layout design process. Work with external and internal PIC and EIC suppliers to define product spec, integration design rules, testing protocol, and failure analysis methodologies. Lead optical package development to establish package manufacturability and reliability. Collaborate with cross-functional teams consisting of Silicon Photonics, IC design, substrate layout, and module design teams.
Requirements
- Bachelor's degree with 12 years of related experience in optical transceiver electrical design.
- Or Master's degree with 10 years; or a PhD with 7 years experience.
- Expertise optical transceiver electrical and hardware design.
- Experience with signal integrity simulation and power integrity analysis including crosstalk, return loss, jitter, EMI, and power supply noise.
- Experience with high-speed signal validation and analysis verification including material, de-embedding, and component characterization.
Responsibilities
- Drive Co-Packaged Optics and Optical Engine product design and testing activities from initial concept to production.
- Develop Silicon Photonic (PIC) and electronics IC (including TIA, driver, and micro-controller) co-design to achieve DC functionalities and high-speed performance.
- Perform simulations for signal integrity and power integrity analysis, hands-on high speed signal validation and analysis verification including material, de-embedding, and component characterization.
- Power delivery modeling, simulation, and characterization for die, package, board, and voltage regulators.
- PCB stack-up review and layer assignment for High speed and PDN
- Manage PIC and EIC interconnect schematic and monitor layout design process.
- Work with external and internal PIC and EIC suppliers to define product spec, integration design rules, testing protocol, and failure analysis methodologies.
- Lead optical package development to establish package manufacturability and reliability.
- Collaborate with cross-functional teams consisting of Silicon Photonics, IC design, substrate layout, and module design teams.
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Industry
Electrical Equipment, Appliance, and Component Manufacturing
Number of Employees
1,001-5,000 employees
